参数资料
型号: MMDF2P02ER2G
厂商: ON Semiconductor
文件页数: 2/7页
文件大小: 0K
描述: MOSFET PWR P-CH 25V 2.5A 8-SOIC
产品变化通告: Product Obsolescence 21/Jan/2010
标准包装: 2,500
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 25V
电流 - 连续漏极(Id) @ 25° C: 2.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 250 毫欧 @ 2A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 10V
输入电容 (Ciss) @ Vds: 475pF @ 16V
功率 - 最大: 2W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
MMDF2P02E
ELECTRICAL CHARACTERISTICS (T A = 25 ° C unless otherwise noted) (N ote 3)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain ? to ? Source Breakdown Voltage
(V GS = 0 Vdc, I D = 250 m Adc)
Temperature Coefficient (Positive)
Zero Gate Voltage Drain Current
(V DS = 20 Vdc, V GS = 0 Vdc)
(V DS = 20 Vdc, V GS = 0 Vdc, T J = 125 ° C)
Gate ? Body Leakage Current (V GS = ± 20 Vdc, V DS = 0)
V (BR)DSS
I DSS
I GSS
25
?
?
?
?
?
2.2
?
?
?
?
?
1.0
10
100
Vdc
mV/ ° C
m Adc
nAdc
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
(V DS = V GS , I D = 250 m Adc)
Temperature Coefficient (Negative)
Static Drain ? to ? Source On ? Resistance
(V GS = 10 Vdc, I D = 2.0 Adc)
(V GS = 4.5 Vdc, I D = 1.0 Adc)
Forward Transconductance (V DS = 3.0 Vdc, I D = 1.0 Adc)
V GS(th)
R DS(on)
g FS
1.0
?
?
?
1.0
2.0
3.8
0.19
0.3
2.8
3.0
?
0.25
0.4
?
Vdc
W
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
C iss
?
340
475
pF
Output Capacitance
Transfer Capacitance
(V DS = 16 Vdc, V GS = 0 Vdc,
f = 1.0 MHz)
C oss
C rss
?
?
220
75
300
150
SWITCHING CHARACTERISTICS (Note 5)
Turn ? On Delay Time
t d(on)
?
20
40
ns
Rise Time
Turn ? Off Delay Time
Fall Time
Turn ? On Delay Time
Rise Time
Turn ? Off Delay Time
Fall Time
(V DD = 10 Vdc, I D = 2.0 Adc,
V GS = 5.0 Vdc, R G = 6.0 W )
(V DD = 10 Vdc, I D = 2.0 Adc,
V GS = 10 Vdc, R G = 6.0 W )
t r
t d(off)
t f
t d(on)
t r
t d(off)
t f
?
?
?
?
?
?
?
40
53
41
13
29
30
28
80
106
82
26
58
60
56
Gate Charge
(V DS = 16 Vdc, I D = 2.0 Adc,
V GS = 10 Vdc)
Q T
Q 1
Q 2
Q 3
?
?
?
?
10
1.0
3.5
3.0
15
?
?
?
nC
SOURCE ? DRAIN DIODE CHARACTERISTICS
Forward On ? Voltage (Note 4)
Reverse Recovery Time
See Figure 11
Reverse Recovery Storage Charge
(I S = 2.0 Adc, V GS = 0 Vdc)
(I S = 2.0 Adc, V GS = 0 Vdc,
dI S /dt = 100 A/ m s)
V SD
t rr
t a
t b
Q RR
?
?
?
?
?
1.5
32
19
12
0.035
2.0
64
?
?
?
Vdc
ns
m C
3. Negative sign for P ? Channel device omitted for clarity.
4. Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2%.
5. Switching characteristics are independent of operating junction temperature.
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