- 您现在的位置：买卖IC网 > PDF目录45351 > MPC603EFEX266LX (FREESCALE SEMICONDUCTOR INC) 32-BIT, 266 MHz, RISC PROCESSOR, CQFP240 PDF资料下载
参数资料
| 型号： | MPC603EFEX266LX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, CQFP240 |
| 封装： | 32 X 32 MM, 0.50 MM PITCH, CERAMIC, QFP-240 |
| 文件页数： | 20/32页 |
| 文件大小： | 498K |
| 代理商： | MPC603EFEX266LX |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页当前第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页
PID6-603e Hardware Specifications, Rev 2
27
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
Wakeeld Engineering
617-245-5900
60 Audubon Rd.
Wakeeld, MA 01880
Aavid Engineering
603-528-3400
One Kool Path
Laconia, NH 03247-0440
Ultimately, the nal selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.8.6.1 Internal Package Conduction Resistance
For this packaging technology the intrinsic thermal conduction resistance (shown in Table 3) versus the
external thermal resistance paths are shown in Figure 15 for a package with an attached heat sink mounted
to a printed-circuit board.
Figure 15. Package with Heat Sink Mounted to a Printed-Circuit Board
1.8.6.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 16 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, oroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease signicantly reduces the interface thermal resistance. That is, the bare joint results
in a thermal resistance approximately 7 times greater than the thermal grease joint.
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
AR
CH
IVE
D B
Y F
RE
ES
CA
LE
SE
MI
CO
ND
UC
TO
R,
INC
.
相关PDF资料 |
PDF描述 |
|---|---|
| MPC603EZT200TX | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA255 |
| MPC603ERX300LX | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 |
| MPC603ERX300TX | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 |
| MPC603PRX233LX | 32-BIT, 233 MHz, RISC PROCESSOR, CBGA255 |
| MPC603PRX180LX | 32-BIT, 180 MHz, RISC PROCESSOR, CBGA255 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC603ERX100LN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX100TN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX133LN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX133TN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603RRX200LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。