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参数资料
| 型号： | MPC7410RX500LD |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 21/52页 |
| 文件大小： | 943K |
| 代理商： | MPC7410RX500LD |
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28
MPC7410 RISC Microprocessor Hardware Specifications
MOTOROLA
Pinout Listings
VDD
G8, G10, G12, J8, J10, J12, L8, L10, L12, N8,
N10, N12
——
N/A
Notes:
1.
OVDD supplies power to the processor bus, JTAG, and all control signals except the L2 cache controls (L2CE,
L2WE, and L2ZZ); L2OVDD supplies power to the L2 cache interface (L2ADDR[0:18], L2DATA[0:63], L2DP[0:7],
and L2SYNC_OUT) and the L2 control signals; and VDD supplies power to the processor core and the PLL and
DLL (after filtering to become AVDD and L2AVDD, respectively). These columns serve as a reference for the
nominal voltage supported on a given signal as selected by the BVSEL/L2VSEL pin configurations of Table 2 and
2.
These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.
3.
To allow for future I/O voltage changes, provide the option to connect BVSEL and L2VSEL independently to either
OVDD, GND, HRESET, or HRESET. For the MPC7410 the L2 bus only supports 2.5- and 1.8-V options. The
default selection, if L2VSEL is left unconnected, is 2.5-V operation. For the MPC7410 the processor bus supports
3.3-, 2.5-, and 1.8-V options. The default selection, if BVSEL is left unconnected, is 3.3-V operation. Refer to
Table 2 for supported BVSEL and L2VSEL settings.
4.
PLL_CFG[0:3] must remain stable during operation; should only be changed during the assertion of HRESET or
during sleep mode and must adhere to the internal PLL-relock time requirement.
5.
Ignored input in 60x bus mode.
6.
Unused output in 60x bus mode. Signal is three-stated in 60x mode.
7.
Deasserted (pulled high) at HRESET negation for 60x bus mode. Asserted (pulled low) at HRESET negation for
MPX bus mode.
8.
Uses one of nine existing no connects in the MPC750 360 BGA package.
9.
Internal pull up on die. Pulled-up signals are VDD based.
10. Reuses MPC750 DRTRY, DBDIS, and TLBISYNC pins (DTI1, DTI2, and EMODE, respectively).
11. The VOLTDET pin position on the MPC750 360 CBGA package is now an L2OVDD pin on the MPC7410
360 CBGA package.
12. Output only for MPC7410, was I/O for MPC750.
13. MPX bus mode only.
14. If necessary, to overcome the internal pull-up resistance and ensure this input will recognize a low signal, a
pull-down resistance less than 250
should be used.
15. MCP minimum pulse width: asynchronous, falling-edge input needs to be held asserted for a minimum of 2 cycles
to guarantee that it is latched by the processor.
16. In MPX bus mode the ABB signal is called AMON and the DBB signal is called DMON. These signals are not a
requirement of the MPX bus protocol and may not be available on future products.
Table 12. Pinout Listing for the MPC7410, 360 CBGA and 360 HCTE Packages (continued)
Signal Name
Pin Number
Active
I/O
I/F Select 1
Notes
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相关代理商/技术参数 |
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|---|---|
| MPC7410RX500LE | 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| MPC7410THX400LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX400NE | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk |
| MPC7410THX450NE | 功能描述:微处理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX500LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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