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参数资料
| 型号： | MPC7410RX500LD |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 51/52页 |
| 文件大小： | 943K |
| 代理商： | MPC7410RX500LD |
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8
MPC7410 RISC Microprocessor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
1.4
Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the MPC7410.
1.4.1
DC Electrical Characteristics
The tables in this section describe the MPC7410 DC electrical characteristics. Table 1 provides the absolute
maximum ratings.
Table 1. Absolute Maximum Ratings 1
Characteristic
Symbol
Maximum Value
Unit
Notes
Core supply voltage
VDD
–0.3 to 2.1
V
4
PLL supply voltage
AVDD
–0.3 to 2.1
V
4
L2 DLL supply voltage
L2AVDD
–0.3 to 2.1
V
4
Processor bus supply voltage
OVDD
–0.3 to 3.6
V
3, 6
L2 bus supply voltage
L2OVDD
–0.3 to 2.8
V
3
Input voltage
Processor bus
Vin
–0.3 to OVDD + 0.2 V
V
2, 5
L2 bus
Vin
–0.3 to L2OVDD + 0.2 V
V
2, 5
JTAG signals
Vin
–0.3 to OVDD + 0.2 V
V
Storage temperature range
Tstg
–55 to 150
°C
Rework temperature
Trwk
260
°C
Notes:
1. Functional and tested operating conditions are given in Table 3. Absolute maximum ratings are stress ratings only,
and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device
reliability or cause permanent damage to the device.
2. Caution: Vin must not exceed OVDD or L2OVDD by more than 0.2 V at any time including during power-on reset.
3. Caution: L2OVDD/OVDD must not exceed VDD/AVDD/L2AVDD by more than 2.0 V at any time including during
power-on reset; this limit may be exceeded for a maximum of 20 ms during power-on reset and power-down
sequences.
4. Caution: VDD/AVDD/L2AVDD must not exceed L2OVDD/OVDD by more than 0.4 V at any time including during
power-on reset; this limit may be exceeded for a maximum of 20 ms during power-on reset and power-down
sequences.
6. MPC7410RXnnnLE (Rev. 1.4) and later only. Previous revisions do not support 3.3 V OVDD and have a maximum
value OVDD of –0.3 to 2.8 V.
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相关代理商/技术参数 |
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|---|---|
| MPC7410RX500LE | 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| MPC7410THX400LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX400NE | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk |
| MPC7410THX450NE | 功能描述:微处理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX500LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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