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参数资料
| 型号： | MPC7410RX500LD |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 41/52页 |
| 文件大小： | 943K |
| 代理商： | MPC7410RX500LD |
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46
MPC7410 RISC Microprocessor Hardware Specifications
MOTOROLA
Document Revision History
Table 1—updated voltage sequencing requirements notes 3 and 4.
Table 4—Updated/added thermal characteristics.
Table 5—removed table and TAU related information, TAU is no longer supported.
Table 6—updated Iin and ITSI leakage current specs.
Section 1.8.3—removed section.
Section 1.10—reformatted section.
Section 1.8.6—changed recommended pull-up resistor value to 1 kW–5 kW. Added AACK, TEA, and
TS to control signals needing pull-ups. Added pull-up resistor value recomendation for L1_TSTCLK,
L2_TSTCLK, and LSSD_MODE factory test signals.
Section 1.8.7—revised text regarding connection of TRST. Combined Figure 22, Figure 23, and Table
17, into Figure 21.
Table 7—corrected min VCO frequencies from 450 to 700 MHz to match min processor frequency of
350 MHz.
Table 2—added note 3 to clarify BVSEL for revisions prior to Rev. E which do not support 3.3 V OVDD.
Table 3—added notes 5 and 6 to clarify BVSEL for revisions prior to Rev. E which do not support 3.3 V
OVDD.
Table 5—added note 8 regarding DC voltage limits for JTAG signals.
1.1
Internal release.
Table 12—added note 16 for ABB/AMON and DBB/DMON signal clarification.
Table 12—changed CHK note 4 reference to note 2, signal is for factory test only. Changed previous
note 4 (CHK related) to now provide additional PLL info.
Table 1—modified maximum value for OVDD from –0.3 to 3.465 to now be –0.3 to 3.6 and L2OVDD from
–0.3 to 2.6 to now be –0.3 to 2.8. Modified note 6, OVDD for revisions prior to Rev. 1.4 have maximum
value for OVDD of –0.3 to 2.8.
Table 8—removed note 12. L2_TSTCLK is for factory use only (see Table 12, note 2).
Section 1.10.2—revised section to include nomenclature tables for part markings not covered by this
spec.
Figure 2—added that under/overshoot for L2OVDD references tL2CLK while OVDD references tSYSCLK.
Table 4—added HCTE package (HX package descriptor) thermal characteristics.
Section 1.5—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same pin assignments.
Section 1.6—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same pinout listings.
Section 1.7—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same package parameters and dimensions.
Table 17—added HCTE package (HX package descriptor) to part numbering nomenclature.
Table 21—added MPC7410THXnnnLE extended temperature HCTE package part numbers and part
number specification document reference.
Table 16. Document Revision History (continued)
Rev. No.
Substantive Change(s)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC7410RX500LE | 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| MPC7410THX400LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX400NE | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk |
| MPC7410THX450NE | 功能描述:微处理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX500LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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