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| 型号： | MPC7410RX500LD |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 29/52页 |
| 文件大小： | 943K |
| 代理商： | MPC7410RX500LD |
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MOTOROLA
MPC7410 RISC Microprocessor Hardware Specifications
35
System Design Information
1.8.5
Output Buffer DC Impedance
The MPC7410 60x and L2 I/O drivers are characterized over process, voltage, and temperature. To measure
Z0, an external resistor is connected from the chip pad to OVDD or GND. Then, the value of each resistor is
The output impedance is the average of two components, the resistances of the pull-up and pull-down
devices. When data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the voltage at the
pad equals (L2)OVDD/2. RN then becomes the resistance of the pull-down devices. When data is held high,
SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals (L2)OVDD/2. RP then
becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value.
Then, Z0 = (RP + RN)/2.
Figure 21 describes the driver impedance measurement circuit described above.
Figure 21. Driver Impedance Measurement Circuit
Alternately, the following is another method to determine the output impedance of the MPC7410. A voltage
source, Vforce, is connected to the output of the MPC7410, as in Figure 22. Data is held low, the voltage
source is set to a value that is equal to (L2)OVDD/2, and the current sourced by Vforce is measured. The
voltage drop across the pull-down device, which is equal to (L2)OVDD/2, is divided by the measured current
to determine the output impedance of the pull-down device, RN. Similarly, the impedance of the pull-up
device is determined by dividing the voltage drop of the pull-up, (L2)OVDD/2, by the current sank by the
pull-up when the data is high and Vforce is equal to (L2)OVDD/2. This method can be employed with either
empirical data from a test setup or with data from simulation models, such as IBIS.
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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相关代理商/技术参数 |
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| MPC7410RX500LE | 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| MPC7410THX400LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX400NE | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk |
| MPC7410THX450NE | 功能描述:微处理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX500LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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