参数资料
型号: MPC8314VRADDA
厂商: Freescale Semiconductor
文件页数: 19/101页
文件大小: 0K
描述: MPU POWERQUICC II PRO 620-PBGA
标准包装: 36
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 266MHz
电压: 1V
安装类型: 表面贴装
封装/外壳: 620-BBGA 裸露焊盘
供应商设备封装: 620-PBGA(29x29)
包装: 托盘
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
24
Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
9.2
MII, RMII, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for MII, RMII, RGMII, and RTBI are presented in this section.
9.2.1
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
9.2.1.1
MII Transmit AC Timing Specifications
This table provides the MII transmit AC timing specifications.
This figure shows the MII transmit AC timing diagram.
Figure 9. MII Transmit AC Timing Diagram
Note:
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
Table 25. MII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 300 mv.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
—400
ns
TX_CLK clock period 100 Mbps
tMTX
—40—
ns
TX_CLK duty cycle
tMTXH/tMTX
35
65
%
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
tMTKHDX
1
5
15
ns
TX_CLK data clock rise VIL(min) to VIH(max)
tMTXR
1.0
4.0
ns
TX_CLK data clock fall VIH(max) to VIL(min)
tMTXF
1.0
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit
timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general,
the clock reference symbol representation is based on two to three letters representing the clock of a particular functional.
For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is
used with the appropriate letter: R (rise) or F (fall).
Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics (continued)
Parameters
Symbol
Conditions
Min
Max
Unit
TX_CLK
TXD[3:0]
tMTKHDX
tMTX
tMTXH
tMTXR
tMTXF
TX_EN
TX_ER
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