- 您现在的位置：买卖IC网 > PDF目录80531 > MPC8378ECVRAGDA (FREESCALE SEMICONDUCTOR INC) 32-BIT, 266 MHz, MICROPROCESSOR, PBGA689 PDF资料下载
参数资料
| 型号： | MPC8378ECVRAGDA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, MICROPROCESSOR, PBGA689 |
| 封装： | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689 |
| 文件页数： | 18/125页 |
| 文件大小： | 894K |
| 代理商： | MPC8378ECVRAGDA |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页当前第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页
MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
114
The junction to ambient thermal resistance is an industry-standard value that provides a quick and easy estimation of thermal
performance. Generally, the value obtained on a single layer board is appropriate for a tightly packed printed circuit board. The
value obtained on the board with the internal planes is usually appropriate if the board has low power dissipation and the
components are well separated. Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
23.2.2
Estimation of Junction Temperature with Junction-to-Board Thermal
Resistance
NOTE
The heat sink cannot be mounted on the package.
The thermal performance of a device cannot be adequately predicted from the junction to ambient thermal resistance. The
thermal performance of any component is strongly dependent on the power dissipation of surrounding components. In addition,
the ambient temperature varies widely within the application. For many natural convection and especially closed box
applications, the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature
near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description
of the local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TA + (RJB PD)
where:
TA = ambient temperature for the package (C)
RJB = junction to board thermal resistance (C/W) per JESD51-8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made.
The application board should be similar to the thermal test condition: the component is soldered to a board with internal planes.
23.2.3
Experimental Determination of Junction Temperature
NOTE
The heat sink cannot be mounted on the package.
To determine the junction temperature of the device in the application after prototypes are available, use the thermal
characterization parameter (
JT) to determine the junction temperature and a measure of the temperature at the top center of
the package case using the following equation:
TJ = TT + (JT PD)
where:
TJ = junction temperature (C)
TT = thermocouple temperature on top of package (C)
JT = junction to ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type T thermocouple
epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests
on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from
the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling
effects of the thermocouple wire.
相关PDF资料 |
PDF描述 |
|---|---|
| MB90587CPMC | MICROCONTROLLER, PQFP100 |
| MB95F212HPH-G-SNE2 | MICROCONTROLLER, PDIP8 |
| MB95F213HPH-G-SNE2 | MICROCONTROLLER, PDIP8 |
| MC9S08SH8MTGR | MICROCONTROLLER, PDSO16 |
| MC8641HX1250NB | MICROPROCESSOR, CBGA1023 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8378ECVRAGFA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378ECVRAGGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378ECVRAJDA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378ECVRAJF | 功能描述:微处理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8378ECVRAJFA | 功能描述:微处理器 - MPU 8378 PBGA XT PbFr W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。