参数资料
型号: MPC8555PXALF
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件页数: 2/88页
文件大小: 772K
代理商: MPC8555PXALF
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 3.1
10
Freescale Semiconductor
Electrical Characteristics
supply, and the manner in which different voltages are derived. However, with the advancement in the
PowerQUICC III ESD design, the order in which the various PowerQUICC III power rails ramp is open
without adverse effect to the PowerQUICC III device as long as the supplies do not exceed to absolute
maximum ratings.
2.1.3
Recommended Operating Conditions
Table 2 provides the recommended operating conditions for the MPC8555E. Note that the values in
Table 2 are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Recommended Value
Unit
Core supply voltage
VDD
1.2 V ± 60 mV
1.3 V± 50 mV(for 1 GHz only)
V
PLL supply voltage
AVDD
1.2 V ± 60 mV
1.3 V ± 50 mV(for 1 GHz only)
V
DDR DRAM I/O voltage
GVDD
2.5 V ± 125 mV
V
Three-speed Ethernet I/O voltage
LVDD
3.3 V ± 165 mV
2.5 V ± 125 mV
V
PCI, local bus, DUART, system control and power
management, I2C, and JTAG I/O voltage
OVDD
3.3 V ± 165 mV
V
Input voltage
DDR DRAM signals
MVIN
GND to GVDD
V
DDR DRAM reference
MVREF
GND to GVDD
V
Three-speed Ethernet signals
LVIN
GND to LVDD
V
PCI, local bus, DUART,
SYSCLK, system control and
power management, I2C, and
JTAG signals
OVIN
GND to OVDD
V
Die-junction Temperature
Tj
0 to 105
°C
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