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参数资料
型号： MPC8560CPX667JC
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封装： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, PLASTIC, FCBGA-783
文件页数： 86/104页
文件大小： 1244K
代理商： MPC8560CPX667JC
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
82
Freescale Semiconductor
Thermal
16.2
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment
method to the heat sink is illustrated in Figure 51. The heat sink should be attached to the printed-circuit
board with the spring force centered over the die. This spring force should not exceed 10 pounds force.
Figure 51. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the device. There
are several commercially-available heat sinks from the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Junction-to-case thermal
RθJC
0.8
C/W
4
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1). Cold plate temperature is used for case temperature; measured value includes the thermal
resistance of the interface layer.
Table 60. Package Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Notes
Thermal Interface Material
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Die
Lid
Adhesive or
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相关代理商/技术参数
参数描述
MPC8560CPX667LB 功能描述:微处理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8560CVT667JB 功能描述:微处理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8560CVT667JC 功能描述:微处理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8560CVT667LB 功能描述:微处理器 - MPU PQ 3 8560 Dracom RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8560PX667LB 功能描述:微处理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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