参数资料
型号: MPC8560VT667LC
厂商: Freescale Semiconductor
文件页数: 3/36页
文件大小: 0K
描述: IC MPU POWERQUICC III 783-FCPBGA
标准包装: 36
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 667MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 784-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
配用: MPC8560ADS-BGA-ND - BOARD APPLICATION DEV 8560
MOTOROLA
MPC8560 PowerQUICC III
11
Integrated Communications Processor Product Brief
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
e500 Core Overview
Extended exception handling
— Supports Book E interrupt model
– Interrupt vector prefix register (IVPR)
– Vector offset registers (IVORs) 0–15 as defined in Book E, plus e500-defined IVORs 32–35
– Exception syndrome register (ESR)
– Book E–defined preempting critical interrupt, including critical interrupt status registers
(CSRR0 and CSRR1) and an rfci instruction
— e500-specific interrupts not defined in Book E architecture
– SPE APU unavailable exception
– Floating-point data exception
– Floating-point round exception
– Performance monitor
Memory management unit (MMU)
— Data L1 MMU
– Four-entry, fully-associative TLB array for variable-sized pages
– 64-entry, four-way set-associative TLB for 4-Kbyte pages
— Instruction L1 MMU
– Four-entry, fully-associative TLB array for variable-sized pages
– 64-entry, four-way set-associative TLB for 4-Kbyte pages
—Unified L2 MMU
– 16-entry, fully-associative TLB array for variable-sized pages
– 256-entry, two-way set-associative TLB for 4-Kbyte pages
— Software reload for TLBs
— Virtual memory support for as much as 4 Gbytes (232) of virtual memory
— Real memory support for as much as 4 Gbytes (232) of physical memory
— Support for big-endian and true little-endian memory on a per-page basis
Power management
— Low power, 1.2-V design
— Dynamic power management on the core minimizes power consumption of functional units,
such as execution units, caches, and MMUs, when they are idle.
— Core power-saving modes: core-halted and core-stopped
— NAP, DOZE, and SLEEP bits in HID0 that can be used to assert nap, doze, and sleep core output
signals to initiate power-saving modes at the integrated-device level
— Internal clock multipliers of 2x, 2.5x, and 3x from bus clock
Testability
— LSSD scan design
— JTAG interface
— ESP support
— ABIST for arrays
—LBIST
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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