参数资料
型号: MPC8569VTAUNLB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783
文件页数: 117/126页
文件大小: 2847K
代理商: MPC8569VTAUNLB
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Serial RapidIO (SRIO)
Freescale Semiconductor
90
(RD and RD). Each signal swings between A volts and B volts where A > B. Using these waveforms, the definitions are as
follows:
1.
The transmitter output signals and the receiver input signals TD, TD, RD, and RD each have a peak-to-peak swing of
A – B volts
2.
The differential output signal of the transmitter, VOD, is defined as VTD – VTD
3.
The differential input signal of the receiver, VID, is defined as VRD – VRD
4.
The differential output signal of the transmitter and the differential input signal of the receiver each range from A – B
to –(A – B) volts
5.
The peak value of the differential transmitter output signal and the differential receiver input signal is A – B volts
6.
The peak-to-peak value of the differential transmitter output signal and the differential receiver input signal is 2
× (A
– B) volts
Figure 47. Differential Peak-Peak Voltage of Transmitter or Receiver
To illustrate these definitions using real values, consider the case of a CML (current mode logic) transmitter that has a common
mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing that goes between 2.5 and 2.0 V. Using these values,
the peak-to-peak voltage swing of the signals TD and TD is 500 mV p-p. The differential output signal ranges between 500 and
–500 mV. The peak differential voltage is 500 mV. The peak-to-peak differential voltage is 1000 mV p-p.
2.11.2
Equalization
With the use of high speed serial links, the interconnect media will cause degradation of the signal at the receiver. Effects such
as inter-symbol interference (ISI) or data dependent jitter are produced. This loss can be large enough to degrade the eye opening
at the receiver beyond what is allowed in the specification. To negate a portion of these effects, equalization can be used. The
most common equalization techniques that can be used are:
Pre-emphasis on the transmitter
A passive high pass filter network placed at the receiver. This is often referred to as passive equalization.
The use of active circuits in the receiver. This is often referred to as adaptive equalization.
Differential Peak-to-Peak = 2
× (A – B)
A Volts
TD or RD
B Volts
相关PDF资料
PDF描述
MPC8308CVMAGDA RISC MICROCONTROLLER, PBGA473
MPC8308VMAFDA RISC MICROCONTROLLER, PBGA473
MK60DN256ZVMC10 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121
MK60DX256ZVMC10 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121
MC9S08AC60CPUE 8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP64
相关代理商/技术参数
参数描述
MPC8572CLVTAULD 功能描述:微处理器 - MPU 1333 LOW PWR EXT TEMP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572CLVTAULE 功能描述:微处理器 - MPU R211 NoE NoPb 1333LP Ext RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572CLVTAVND 功能描述:微处理器 - MPU 1500 ExtTmp LwPwr RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572CLVTAVNE 功能描述:微处理器 - MPU R211 NoE NoPb 1500LP Ext RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572CVTAVNE 功能描述:微处理器 - MPU R211 NoE NoPb 1500 Ext RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324