参数资料
型号: MPC8569VTAUNLB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783
文件页数: 22/126页
文件大小: 2847K
代理商: MPC8569VTAUNLB
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Thermal Characteristics
Freescale Semiconductor
118
The following figure shows the UTOPIA/POS timing with internal clock.
Figure 72. UTOPIA/POS AC Timing (Internal Clock) Diagram
3
Thermal
This section describes the thermal specifications of the MPC8569E.
3.1
Thermal Characteristics
The following table provides the package thermal characteristics of the MPC8569E.
3.2
Recommended Thermal Model
Information about Flotherm models of the package or thermal data not available in this document can be obtained from your
local Freescale sales office.
Table 81. Package Thermal Characteristics
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Junction-to-ambient Natural Convection
Single layer board (1s)
RθJA
16
° C/W
1, 2
Junction-to-ambient Natural Convection
Four layer board (2s2p)
RθJA
12
° C/W
1, 2
Junction-to-ambient (at 200 ft/min)
Single layer board (1s)
RθJA
12
° C/W
1, 2
Junction-to-ambient (at 200 ft/min)
Four layer board (2s2p)
RθJA
9
° C/W
1, 2
Junction-to-board thermal
RθJB
5
° C/W
3
Junction-to-case thermal
RθJC
1.0
° C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 and JESD51-6 with the board (JESD51-9) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer.
UTOPIACLK (Output)
tUIIXKH
tUIKHOV
Input Signals:
UTOPIA
Output Signals:
UTOPIA
tUIIVKH
tUIKHOX
相关PDF资料
PDF描述
MPC8308CVMAGDA RISC MICROCONTROLLER, PBGA473
MPC8308VMAFDA RISC MICROCONTROLLER, PBGA473
MK60DN256ZVMC10 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121
MK60DX256ZVMC10 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121
MC9S08AC60CPUE 8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP64
相关代理商/技术参数
参数描述
MPC8572CLVTAULD 功能描述:微处理器 - MPU 1333 LOW PWR EXT TEMP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572CLVTAULE 功能描述:微处理器 - MPU R211 NoE NoPb 1333LP Ext RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572CLVTAVND 功能描述:微处理器 - MPU 1500 ExtTmp LwPwr RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572CLVTAVNE 功能描述:微处理器 - MPU R211 NoE NoPb 1500LP Ext RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572CVTAVNE 功能描述:微处理器 - MPU R211 NoE NoPb 1500 Ext RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324