收藏本站
参数资料
型号： MPC8572PXAULB
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 1333 MHz, MICROPROCESSOR, PBGA1023
封装： 33 X 33 MM, PLASTIC, FCBGA-1023
文件页数： 28/138页
文件大小： 1502K
代理商： MPC8572PXAULB
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
123
Thermal
20 Thermal
This section describes the preliminary thermal specifications of the MPC8572E. This is subject to change.
Table 81 shows the thermal characteristics for the package, 1023 33x33 FC-PBGA.
The package uses a 29.6 x 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink
force is 10 pounds force (45 Newton).
20.1
Temperature Diode
The MPC8572E has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature of
the microprocessor and its environment. It is recommended that each MPC8572E device be calibrated.
The following are the specifications of the on-board temperature diode:
Vf > 0.40 V
Vf < 0.90 V
Operating range 2–300
μA
Diode leakage < 10 nA @ 125
°C
An approximate value of the ideality may be obtained by calibrating the device near the expected
operating temperature.
Table 81. Package Thermal Characteristics
Rating
Board
Symbol
Value
Unit
Notes
Junction to ambient, natural convection
Single-layer (1s)
RΘJA
15
°C/W
1, 2
Junction to ambient, natural convection
Four-layer (2s2p)
RΘJA
11
°C/W
1, 3
Junction to ambient (at 200 ft./min.)
Single-layer (1s)
RΘJMA
11
°C/W
1, 3
Junction to ambient (ar 200 ft./min.)
Four-layer (2s2p)
RΘJMA
8
°C/W
1, 3
Junction to board
—
RΘJB
4
°C/W
4
Junction to case
—
RΘJC
0.5
°C/W
5
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance
2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method
(MIL SPEC-883, Method 1012.1).
相关PDF资料
PDF描述
MPC8572CPXAUND 32-BIT, 1333 MHz, MICROPROCESSOR, PBGA1023
MPC8572ECPXAUNB 32-BIT, 1333 MHz, MICROPROCESSOR, PBGA1023
MPC8572VTAVLD 32-BIT, 1500 MHz, MICROPROCESSOR, PBGA1023
MPC8572CVTAULD 32-BIT, 1333 MHz, MICROPROCESSOR, PBGA1023
MPC8572EVTATND 32-BIT, 1200 MHz, MICROPROCESSOR, PBGA1023
相关代理商/技术参数
参数描述
MPC8572PXAULD 功能描述:微处理器 - MPU PQ38H CSM SNPB 1333 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572PXAULE 制造商:Freescale Semiconductor 功能描述:38H R211 NOE SNPB 1333 - Bulk
MPC8572PXAVNB 功能描述:微处理器 - MPU RV1.1.1 SNPB 1500 NOTENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572PXAVND 功能描述:微处理器 - MPU PQ38H CSM SNPB 1500 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572PXAVNE 制造商:Freescale Semiconductor 功能描述:38H R211 NOE SNPB 1500 - Bulk
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*