参数资料
型号: MPC941AE
厂商: IDT, Integrated Device Technology Inc
文件页数: 3/13页
文件大小: 0K
描述: IC CLOCK BUFFER MUX 1:27 48-LQFP
标准包装: 250
类型: 扇出缓冲器(分配),多路复用器
电路数: 1
比率 - 输入:输出: 1:27
差分 - 输入:输出: 是/无
输入: LVCMOS,LVPECL
输出: LVCMOS
频率 - 最大: 250MHz
电源电压: 2.375 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-LQFP
供应商设备封装: 48-TQFP(7x7)
包装: 托盘
MPC941 REVISION 9 JANUARY 7, 2013
11
2013 Integrated Device Technology, Inc.
MPC941 Data Sheet
LOW VOLTAGE, 1:27 CLOCK DISTRIBUTION CHIP
PACKAGE DIMENSIONS
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5m, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLAN AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUMS T, U, AND Z TO BE DETERMINED AT
DATAUM PLANE AB.
DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
A
A1
Z
0.200 AB T-U
4X
Z
0.200 AC T-U
4X
B
B1
1
12
13
24
25
36
37
48
S1
S
V
V1
DETAIL Y
9
T
U
Z
P
AE
T, U, Z
DETAIL Y
M
TOP & BOTTOM
L
W
K
AA
E
C
H
0.250
R
DETAIL AD
GA
UGE
PLANE
AD
G
0.080 AC
AB
AC
BASE METAL
N
J
F
D
T-U
M
0.080
Z
AC
SECTION AE-AE
MIN
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0
0.150
MAX
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
7
0.250
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
L
R
S
S1
V
V1
W
AA
MILLIMETERS
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
12 REF
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
CASE 932-03
ISSUE F
48-LEAD LQFP PACKAGE
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