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参数资料
| 型号： | MPC9443FAR2 |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 15/15页 |
| 文件大小： | 0K |
| 描述： | IC CLK BUFF DVDR MUX 3:16 48LQFP |
| 标准包装： | 2,000 |
| 类型： | 扇出缓冲器（分配），除法器，多路复用器 |
| 电路数： | 1 |
| 比率 - 输入:输出： | 3:16 |
| 差分 - 输入:输出： | 是/无 |
| 输入： | LVCMOS，LVPECL |
| 输出： | LVCMOS |
| 频率 - 最大： | 350MHz |
| 电源电压： | 2.375 V ~ 3.465 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-LQFP |
| 供应商设备封装： | 48-TQFP（7x7） |
| 包装： | 带卷 (TR) |
MPC9443 REVISION 6 AUGUST 23, 2013
9
2013 Integrated Device Technology, Inc.
MPC9443 Data Sheet
2.5V, 3.3V LVCMOS CLOCK FANOUT BUFFER
Power Consumption of the MPC9443
and Thermal Management
The MPC9443 AC specification is guaranteed for the entire
operating frequency range up to 350 MHz. The MPC9443 power
consumption and the associated long-term reliability may
decrease the maximum frequency limit, depending on operating
conditions such as clock frequency, supply voltage, output
loading, ambient temperature, vertical convection and thermal
conductivity of package and board. This section describes the
impact of these parameters on the junction temperature and gives
a guideline to estimate the MPC9443 die junction temperature
and the associated device reliability. For a complete analysis of
power consumption as a function of operating conditions and
associated long term device reliability, please refer to the
Freescale application note AN1545. According the AN1545, the
long-term device reliability is a function of the die junction
temperature.
Increased power consumption will increase the die junction
temperature and impact the device reliability (MTBF). According
to the system-defined tolerable MTBF, the die junction
temperature of the MPC9443 needs to be controlled, and the
thermal impedance of the board/package should be optimized.
The power dissipated in the MPC9443 is represented in Equation
1.
Where ICCQ is the static current consumption of the MPC9443,
CPD is the power dissipation capacitance per output. CL
represents the external capacitive output load, and N is the
number of active outputs (N is always 16 in case of the
MPC9443). The MPC9443 supports driving transmission lines to
maintain high signal integrity and tight timing parameters. Any
transmission line will hide the lumped capacitive load at the end of
the board trace; therefore,
CL is zero for controlled transmission
line systems and can be eliminated from Equation 1. Using
parallel termination output termination results in Equation 2 for
power dissipation.
In Equation 2, P stands for the number of outputs with a parallel
or thevenin termination. VOL, IOL, VOH and IOH are a function of
the output termination technique, and DCQ is the clock signal duty
cycle. If transmission lines are used,
CL is zero in Equation 2
and can be eliminated. In general, the use of controlled
transmission line techniques eliminates the impact of the lumped
capacitive loads at the end lines and greatly reduces the power
dissipation of the device. Equation 3 describes the die junction
temperature (TJ) as a function of the power consumption.
Where Rthja is the thermal impedance of the package (junction
to ambient), and TA is the ambient temperature. According to
Table 13, the junction temperature can be used to estimate the
long-term device reliability. Further, combining Equation 1 and
Equation 2 results in a maximum operating frequency for the
MPC9443 in a series terminated transmission line system.
TJ,MAX should be selected according to the MTBF system
2S2P boards will result in a lower thermal impedance than
indicated below.
If the calculated maximum frequency is below 250 MHz, it
becomes the upper clock speed limit for the given application
conditions. The following eight derating charts describe the safe
frequency operation range for the MPC9443. The charts were
calculated for a maximum tolerable die junction temperature of
110
C (120C), corresponding to an estimated MTBF of 9.1 years
(4 years), a supply voltage of 3.3 V and series terminated
transmission line or capacitive loading. Depending on a given set
of these operating conditions and the available device convection
a decision on the maximum operating frequency can be made.
Table 13. Die Junction Temperature and MTFBF
Junction Temperature (
C)
MTBF (Years)
100
20.4
110
9.1
120
4.2
130
2.0
Table 14. Thermal Package Impedance of the 48 ld LQFP
Convection,
LFPM
Rthja (1P2S board),
K/W
Rthja (2P2S board),
K/W
Still air
69
53
100 lfpm
200 lfpm
64
50
300 lfpm
400 lfpm
500 lfpm
PTOT = [ ICCQ + VCC fCLOCK ( N CPD + CL ) ] VCC
M
PTOT = VCC [ ICCQ + VCC fCLOCK ( N CPD + CL ) ] + [ DCQ IOH (VCC – VOH) + (1 – DCQ) IOL VOL ]
MP
TJ = TA + PTOT Rthja
fCLOCK,MAX =
CPD N V2CC
1
[
– (ICCQ VCC)
]
Rthja
Tj,MAX – TA
Equation 1
Equation 2
Equation 3
Equation 4
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| MPC9446 | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:2.5V and 3.3V LVCMOS Clock Fanout Buffer |
| MPC9446AC | 功能描述:时钟缓冲器 2.5 3.3V 275MHz Clock Generator RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| MPC9446ACR2 | 功能描述:时钟驱动器及分配 FSL 1-10 LVCMOS Fanout Buffer RoHS:否 制造商:Micrel 乘法/除法因子:1:4 输出类型:Differential 最大输出频率:4.2 GHz 电源电压-最大: 电源电压-最小:5 V 最大工作温度:+ 85 C 封装 / 箱体:SOIC-8 封装:Reel |
| MPC9446FA | 功能描述:时钟缓冲器 2.5 3.3V 250MHz Clock Generator RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
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