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参数资料
| 型号： | MPQ2222A |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 功率晶体管 |
| 英文描述： | 0.5 A, 40 V, 4 CHANNEL, NPN, Si, POWER TRANSISTOR, TO-116 |
| 封装： | PLASTIC, DIP-14 |
| 文件页数： | 3/25页 |
| 文件大小： | 373K |
| 代理商： | MPQ2222A |
Packaging Specifications
6–6
Motorola Small–Signal Transistors, FETs and Diodes Device Data
TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H
F1
F2
P2
P1
P
D
W
W1
L1
W2
H2B
T1
T
T2
H4 H5
H1
Figure 1. Device Positioning on Tape
L
Specification
Inches
Millimeter
Symbol
Item
Min
Max
Min
Max
D
Tape Feedhole Diameter
0.1496
0.1653
3.8
4.2
D2
Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
F1, F2
Component Lead Pitch
0.0945
0.110
2.4
2.8
H
Bottom of Component to Seating Plane
.059
.156
1.5
4.0
H1
Feedhole Location
0.3346
0.3741
8.5
9.5
H2A
Deflection Left or Right
0
0.039
0
1.0
H2B
Deflection Front or Rear
0
0.051
0
1.0
H4
Feedhole to Bottom of Component
0.7086
0.768
18
19.5
H5
Feedhole to Seating Plane
0.610
0.649
15.5
16.5
L
Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
L1
Lead Wire Enclosure
0.09842
—
2.5
—
P
Feedhole Pitch
0.4921
0.5079
12.5
12.9
P1
Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2
First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
T
Adhesive Tape Thickness
0.06
0.08
0.15
0.20
T1
Overall Taped Package Thickness
—
0.0567
—
1.44
T2
Carrier Strip Thickness
0.014
0.027
0.35
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
W1
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
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相关代理商/技术参数 |
参数描述 |
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| MPQ2222A PBFREE | 制造商:Central Semiconductor Corp 功能描述: |
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| MPQ2451DG-AEC1-LF-P | 功能描述:Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 600mA 6-VDFN Exposed Pad 制造商:monolithic power systems inc. 系列:汽车级，AEC-Q100 包装:剪切带（CT） 零件状态:停产 功能:降压 输出配置:正 拓扑:降压 输出类型:可调式 输出数:1 电压 - 输入（最小值）:3.3V 电压 - 输入（最大值）:36V 电压 - 输出（最小值/固定）:0.8V 电压 - 输出（最大值）:32.4V 电流 - 输出:600mA 频率 - 开关:2MHz 同步整流器:无 工作温度:-40°C ~ 125°C （TJ） 安装类型:表面贴装 封装/外壳:6-VDFN 裸露焊盘 供应商器件封装:6-QFN（2x2） 标准包装:1 |
| MPQ2451DG-LF-P | 功能描述:Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 600mA 6-VDFN Exposed Pad 制造商:monolithic power systems inc. 系列:- 包装:剪切带（CT） 零件状态:有效 功能:降压 输出配置:正 拓扑:降压 输出类型:可调式 输出数:1 电压 - 输入（最小值）:3.3V 电压 - 输入（最大值）:36V 电压 - 输出（最小值/固定）:0.8V 电压 - 输出（最大值）:32.4V 电流 - 输出:600mA 频率 - 开关:2MHz 同步整流器:无 工作温度:-40°C ~ 125°C （TJ） 安装类型:表面贴装 封装/外壳:6-VDFN 裸露焊盘 供应商器件封装:6-QFN（2x2） 标准包装:1 |
| MPQ2451DT-AEC1-LF-P | 制造商:Monolithic Power Systems 功能描述:INDUSTRIAL/AUTOMOTIVE GRADE, 36V, 2MHZ, 0.6A BUCK CONVERTER - Tape and Reel |
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