参数资料
型号: MR25H256CDF
厂商: Everspin Technologies Inc
文件页数: 10/20页
文件大小: 0K
描述: IC MRAM 256KBIT 40MHZ 8DFN
标准包装: 490
格式 - 存储器: RAM
存储器类型: MRAM(磁阻 RAM)
存储容量: 256K (32K x 8)
速度: 40MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-VDFN 裸露焊盘
供应商设备封装: 8-DFN-EP,Small Flag(5x6)
包装: 托盘
其它名称: 819-1038
MR25H256
3. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
This device contains circuitry to protect the inputs against damage caused by high static voltages or
electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage
greater than maximum rated voltages to these high-impedance (Hi-Z) circuits.
The device also contains protection against external magnetic fields. Precautions should be taken to avoid
application of any magnetic field more intense than the field intensity specified in the maximum ratings.
Table 3.1 Absolute Maximum Ratings 1
Symbol
V DD
V IN
I OUT
P D
T BIAS
T stg
T Lead
H max_write
H max_read
Parameter
Supply voltage 2
Voltage on any pin 2
Output current per pin
Package power dissipation 3
Temperature under bias
Storage Temperature
Lead temperature during solder (3
minute max)
Maximum magnetic field (Write)
Maximum magnetic field (Read or
Standby)
Conditions
All
All
All
All
Industrial
AEC-Q100 Grade 1
All
All
During Write
During Read or
Standby
Value
-0.5 to 4.0
-0.5 to V DD + 0.5
±20
0.600
-45 to 95
-45 to 135
-55 to 150
260
12,000
12,000
Unit
V
V
mA
W
°C
°C
°C
°C
A/m
A/m
1
2
3
Permanent device damage may occur if absolute maximum ratings are exceeded. Functional opera-
tion should be restricted to recommended operating conditions. Exposure to excessive voltages or
magnetic fields could affect device reliability.
All voltages are referenced to V SS . The DC value of V IN must not exceed actual applied V DD by more
than 0.5V. The AC value of V IN must not exceed applied V DD by more than 2V for 10ns with I IN limited
to less than 20mA.
Power dissipation capability depends on package characteristics and use environment.
Copyright ? Everspin Technologies 2013
10
MR25H256 Rev. 9, 4/2013
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