参数资料
型号: MRF6P9220HR5
厂商: Freescale Semiconductor
文件页数: 3/12页
文件大小: 458K
描述: MOSFET RF N-CH 28V 47W NI-860C3
标准包装: 50
晶体管类型: LDMOS
频率: 880MHz
增益: 20dB
电压 - 测试: 28V
额定电流: 10µA
电流 - 测试: 1.6A
功率 - 输出: 47W
电压 - 额定: 68V
封装/外壳: NI-860C3
供应商设备封装: NI-860C3
包装: 带卷 (TR)
AR
C
HIVE INF
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RMATI
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ARCHIVE INFORMATION
MRF6P9220HR3
11
RF Device Data
Freescale Semiconductor
PRODUCT DOCUMENTATION
Refer to the following documents to aid your design process.
Application Notes
?
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
?
EB212: Using Data Sheet Impedances for RF LDMOS Devices
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
3
Aug. 2008
?
Listed replacement part and Device Migration notification reference number, p. 1
?
Removed Lower Thermal Resistance and Low Gold Plating bullets from Features section as functionality
is standard, p. 1
?
Removed Total Device Dissipation from Max Ratings table as data was redundant (information already
provided in Thermal Characteristics table), p. 1
?
Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table and related
?Continuous use at maximum temperature will affect MTTF? footnote added, p. 1
?
Corrected VDS
to V
DD
in the RF test condition voltage callout for V
GS(Q), On Characteristics table, p. 2
?
Removed Forward Transconductance from On Characteristics table as it no longer provided usable
information, p. 2
?
Updated PCB information to show more specific material details, Fig. 1, Test Circuit Schematic,
p. 3
?
Updated Part Numbers in Table 5, Component Designations and Values, to latest RoHS compliant part
numbers, p. 3
?
Adjusted scale for Fig. 8, Intermodulation Distortion Products versus Tone Spacing, to show wider
dynamic range, p. 6
?
Removed lower voltage tests from Fig. 12, Power Gain versus Output Power, due to fixed tuned fixture
limitations, p. 7
?
Replaced Fig. 13, MTTF versus Junction Temperature with updated graph. Removed Amps2
and listed
operating characteristics and location of MTTF calculator for device, p. 7
?
Added Product Documentation and Revision History, p. 11
3.1
Dec. 2008
?
Fig. 1, Test Circuit Schematic, Z-list, changed Z6, Z7 from 0.058″
x 1.01
Microstrip to 1.186
x 0.058
Microstrip; Z10, Z11 from 1.054″
x 0.150
Microstrip to 1.306
x 0.150
Microstrip; and Z19, Z20 from
0.165″
x 0.339
Microstrip to 0.339
x 0.165
Microstrip; also separated Z1 and Z18 into two lines in
Z-list, p. 3
?
Table 5, Test Circuit Component Designations and Values, changed part numbers ATC100B102JP50XT to
ATC100B102JT50XT and ATC100B101JP500XT to ATC100B101JT500XT, p. 3
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