参数资料
型号: MRF6V2010NBR1
厂商: Freescale Semiconductor
文件页数: 12/21页
文件大小: 1668K
描述: IC MOSFET RF N-CHAN TO272-2
标准包装: 1
晶体管类型: LDMOS
频率: 220MHz
增益: 23.9dB
电压 - 测试: 50V
额定电流: 2.5mA
电流 - 测试: 30mA
功率 - 输出: 10W
电压 - 额定: 110V
封装/外壳: TO-272BC
供应商设备封装: TO-272-2
包装: 标准包装
其它名称: MRF6V2010NBR1DKR
2
RF Device Data
Freescale Semiconductor
MRF6V2010NR1 MRF6V2010NBR1
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22--A114)
2 (Minimum)
Machine Model (per EIA/JESD22--A115)
A (Minimum)
Charge Device Model (per JESD22--C101)
IV (Minimum)
Table 4. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD 22--A113, IPC/JEDEC J--STD--020
3
260
°C
Table 5. Electrical Characteristics
(TA
=25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Gate--Source Leakage Current
(VGS
=5Vdc,VDS
=0Vdc)
IGSS
?
?
10
μAdc
Drain--Source Breakdown Voltage
(ID
=5mA,VGS
=0Vdc)
V(BR)DSS
110
?
?
Vdc
Zero Gate Voltage Drain Leakage Current
(VDS
=50Vdc,VGS
=0Vdc)
IDSS
?
?
50
μAdc
Zero Gate Voltage Drain Leakage Current
(VDS
= 100 Vdc, VGS
=0Vdc)
IDSS
?
?
2.5
mA
On Characteristics
Gate Threshold Voltage
(VDS
=10Vdc,ID
=28μAdc)
VGS(th)
1
1.68
3
Vdc
Gate Quiescent Voltage
(VDD
=50Vdc,ID
= 30 mAdc, Measured in Functional Test)
VGS(Q)
1.5
2.68
3.5
Vdc
Drain--Source On--Voltage
(VGS
=10Vdc,ID
=70mAdc)
VDS(on)
?
0.26
?
Vdc
Dynamic Characteristics
Reverse Transfer Capacitance
(VDS
=50Vdc±
30 mV(rms)ac @ 1 MHz, VGS
=0Vdc)
Crss
?
0.13
?
pF
Output Capacitance
(VDS
=50Vdc±
30 mV(rms)ac @ 1 MHz, VGS
=0Vdc)
Coss
?
7.3
?
pF
Input Capacitance
(VDS
=50Vdc,VGS
=0Vdc±
30 mV(rms)ac @ 1 MHz)
Ciss
?
16.3
?
pF
Functional Tests
(In Freescale Test Fixture, 50 ohm system) VDD
=50Vdc,IDQ
=30mA,Pout
=10W,f=220MHz,CW
Power Gain
Gps
22.5
23.9
25.5
dB
Drain Efficiency
ηD
58
62
?
%
Input Return Loss
IRL
?
-- 1 4
-- 9
dB
ATTENTION: The MRF6V2010N and MRF6V2010NB are high power devices and special considerations
must be followed in board design and mounting. Incorrect mounting can lead to internal temperatures which
exceed the maximum allowable operating junction temperature. Refer to Freescale Application Note AN3263
(for bolt down mounting) or AN1907 (for solder reflow mounting)
PRIOR TO STARTING SYSTEM DESIGN
to
ensure proper mounting of these devices.
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