参数资料
型号: MRF6V2300NBR5
厂商: Freescale Semiconductor
文件页数: 10/19页
文件大小: 1185K
描述: MOSFET RF N-CH 50V TO-272-4
产品培训模块: RF Broadcast Solutions
标准包装: 1
晶体管类型: LDMOS
频率: 220MHz
增益: 25.5dB
电压 - 测试: 50V
额定电流: 2.5mA
电流 - 测试: 900mA
功率 - 输出: 300W
电压 - 额定: 110V
封装/外壳: TO-272BB
供应商设备封装: TO-272 WB-4
包装: 标准包装
产品目录页面: 560 (CN2011-ZH PDF)
其它名称: MRF6V2300NBR5DKR
18
RF Device Data
Freescale Semiconductor
MRF6V2300NR1 MRF6V2300NBR1
PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following documents to aid your design process.
Application Notes
?
AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
?
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
?
AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
?
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
?
Electromigration MTTF Calculator
?
RF High Power Model
For Software, do a Part Number search at http://www.freescale.com, and select the ?Part Number? link. Go to the Software &
Tools tab on the part?s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Feb. 2007
?
Initial Release of Data Sheet
1
Feb. 2007
?
Added Fig. 1, Pin Connections, p. 1
?
Removed footnote references listed for Operating Junction Temperature, Table 1, Maximum Ratings, p. 1
?
Added Max value to Power Gain, Table 5, Functional Tests, p. 2
2
May 2007
?
Corrected Test Circuit Component part numbers in Table 6, Component Designations and Values for C4,
C19, C5, C18, C9, C12, C14, and C23, p. 3
3
Jan. 2008
?
Increased operating frequency to 600 MHz, p. 1
?
Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 1
?
Corrected Ciss
test condition to indicate AC stimulus on the VGS
connection versus the VDS
connection,
Dynamic Characteristics table, p. 2
?
Updated PCB information to show more specific material details, Fig. 2, Test Circuit Schematic, p. 3
?
Replaced Case Outline 1486--03, Issue C, with 1486--03, Issue D, p. 9--11. Added pin numbers 1 through 4
on Sheet 1.
?
Replaced Case Outline 1484--04, Issue D, with 1484--04, Issue E, p. 12--14. Added pin numbers 1 through
4 on Sheet 1, replacing Gate and Drain notations with Pin 1 and
Pin 2 designations.
4
Dec. 2008
?
Added Typical Performances table for 27 MHz, 450 MHz applications, p. 2
?
Added Figs. 16 and 17, Test Circuit Component Layout -- 27 MHz and 450 MHz, and Tables 7 and 8, Test
Circuit Component Designations and Values -- 27 MHz and 450 MHz, p. 9, 10
?
Added Fig. 18, Series Equivalent Source and Load Impedance for 27 MHz, 450 MHz, p. 11
5
Apr. 2010
?
Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related
?Continuous use at maximum temperature will affect MTTF? footnote added and changed 200°C to 225°C
in Capable Plastic Package bullet, p. 1
?
Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software,
p. 18
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