参数资料
型号: MSC7116VF1000
厂商: Freescale Semiconductor
文件页数: 53/60页
文件大小: 0K
描述: DSP 16BIT W/DDR CTRLR 400-MAPBGA
标准包装: 90
系列: StarCore
类型: 定点
接口: 主机接口,I²C,UART
时钟速率: 266MHz
非易失内存: ROM(8 kB)
芯片上RAM: 400kB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.20V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 400-LFBGA
供应商设备封装: 400-MAPBGA(17x17)
包装: 托盘
Ordering Information
MSC7116 Data Sheet, Rev. 13
Freescale Semiconductor
57
3.6
Connectivity Guidelines
This section summarizes the connections and special conditions, such as pull-up or pull-down resistors, for the MSC7116
device. Following are guidelines for signal groups and configuration settings:
Clock and reset signals.
SWTE is used to configure the MSC7116 device and is sampled on the deassertion of PORESET, so it should be
tied to VDDC or GND either directly or through pull-up or pull-down resistors until PORESET is deasserted. After
PORESET
, this signal can be left floating.
BM[0–1] configure the MSC7116 device and are sampled until PORESET is deasserted, so they should be tied to
VDDIO or GND either directly or through pull-up or pull-down resistors.
HRESET should be pulled up.
Interrupt signals. When used, IRQ pins must be pulled up.
HDI16 signals.
— When they are configured for open-drain, the HREQ/HREQ or HTRQ/HTRQ signals require a pull-up resistor.
However, these pins are also sampled at power-on reset to determine the HDI16 boot mode and may need to be
pulled down. When these pins must be pulled down on reset and pulled up otherwise, a buffer can be used with
the HRESET signal as the enable.
— When the device boots through the HDI16, the HDDS, HDSP and H8BIT pins should be pulled up or down,
depending on the required boot mode settings.
Ethernet MAC/TDM2 signals. The MDIO signal requires an external pull-up resistor.
I2C signals. The SCL and SDA signals, when programmed for I2C, requires an external pull-up resistor.
General-purpose I/O (GPIO) signals. An unused GPIO pin can be disconnected. After boot, program it as an output
pin.
Other signals.
—The TEST0 pin must be connected to ground.
—The TPSEL pin should be pulled up to enable debug access via the EOnCE port and pulled down for boundary
scan.
— Pins labelled NO CONNECT (NC) must not be connected.
— When a 16-pin double data rate (DDR) interface is used, the 16 unused data pins should be no connects (floating)
if the used lines are terminated.
— Do not connect DBREQ to DONE (as you would for the MSC8101 device). Connect DONE to one of the EVNT
pins, and DBREQ to HRRQ.
4
Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
Supply Voltage
Package Type
Pin
Count
Core
Frequency
(MHz)
Solder Spheres
Order Number
MSC7116
1.2 V core
2.5 V memory
3.3 V I/O
Molded Array Process-Ball Grid
Array (MAP-BGA)
400
266
Lead-free
MSC7116VM1000
Lead-bearing
MSC7116VF1000
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