参数资料
型号: MSM80C85AHGS-2K
厂商: LAPIS SEMICONDUCTOR CO LTD
元件分类: 微控制器/微处理器
英文描述: 8-BIT, 5 MHz, MICROPROCESSOR, PQFP44
封装: PLASTIC, QFP-44
文件页数: 24/32页
文件大小: 355K
代理商: MSM80C85AHGS-2K
29
Semiconductor
MSM80C85AHRS/GS/JS
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
mm or more
0.41 TYP.
QFP44-P-910-0.80-2K
Mirror finish
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相关代理商/技术参数
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