参数资料
型号: MSP430F5519IPN
厂商: TEXAS INSTRUMENTS INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 25 MHz, RISC MICROCONTROLLER, PQFP80
封装: GREEN, PLASTIC, LQFP-80
文件页数: 62/119页
文件大小: 1351K
代理商: MSP430F5519IPN
MSP430F551x
MSP430F552x
SLAS590E
– MARCH 2009 – REVISED APRIL 2011
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
–0.3 V to 4.1 V
Voltage applied to any pin (excluding VCORE, VBUS, V18)(2)
–0.3 V to VCC + 0.3 V
Diode current at any device pin
±2 mA
Storage temperature range, Tstg
(3)
–55°C to 150°C
Maximum operating junction temperature, TJ
95
°C
(1)
Stresses beyond those listed under
"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating
conditions
" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages referenced to VSS. VCORE is for internal device usage only. No external DC loading or voltage should be applied.
(3)
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics
PARAMETER
VALUE
UNIT
LQFP (PN)
70
VQFN (RGC)
55
Low-K board (JESD51-3)
DSBGA (YFF)
TBD
BGA (ZQE)
84
θJA
Junction-to-ambient thermal resistance, still air
°C/W
LQFP (PN)
45
VQFN (RGC)
25
High-K board (JESD51-7)
DSBGA (YFF)
TBD
BGA (ZQE)
46
LQFP (PN)
12
VQFN (RGC)
12
θJC
Junction-to-case thermal resistance
°C/W
DSBGA (YFF)
TBD
BGA (ZQE)
30
LQFP (PN)
22
VQFN (RGC)
6
θJB
Junction-to-board thermal resistance
°C/W
DSBGA (YFF)
TBD
BGA (ZQE)
20
Copyright
2009–2011, Texas Instruments Incorporated
47
相关PDF资料
PDF描述
MSP430F5526IRGCR 16-BIT, FLASH, 25 MHz, RISC MICROCONTROLLER, PQCC64
MSP430F5517IPNR 16-BIT, FLASH, RISC MICROCONTROLLER, PQFP80
MSP430F5519IPNR 16-BIT, FLASH, RISC MICROCONTROLLER, PQFP80
MSP430F5632IPZ 16-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PQFP100
MSP430F5638IPZR 16-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PQFP100
相关代理商/技术参数
参数描述
MSP430F5519IPNR 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F5521IPN 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F5521IPNR 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F5522IRGCR 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F5522IRGCT 功能描述:16位微控制器 - MCU MSP430F551x,MSP430 F552x Mix Sig MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT