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参数资料
型号： MSP430F5519IPN
厂商： TEXAS INSTRUMENTS INC
元件分类： 微控制器/微处理器
英文描述： 16-BIT, FLASH, 25 MHz, RISC MICROCONTROLLER, PQFP80
封装： GREEN, PLASTIC, LQFP-80
文件页数： 72/119页
文件大小： 1351K
代理商： MSP430F5519IPN
MSP430F551x
MSP430F552x
SLAS590E
– MARCH 2009 – REVISED APRIL 2011
www.ti.com
Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(1) (2)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fOSC = 4 MHz, XT2OFF = 0, XT2BYPASS = 0,
200
XT2DRIVEx = 0, TA = 25°C
fOSC = 12 MHz, XT2OFF = 0, XT2BYPASS = 0,
260
XT2DRIVEx = 1, TA = 25°C
XT2 oscillator crystal
IDVCC.XT2
3.0 V
A
current consumption
fOSC = 20 MHz, XT2OFF = 0, XT2BYPASS = 0,
325
XT2DRIVEx = 2, TA = 25°C
fOSC = 32 MHz, XT2OFF = 0, XT2BYPASS = 0,
450
XT2DRIVEx = 3, TA = 25°C
XT2 oscillator crystal
fXT2,HF0
XT2DRIVEx = 0, XT2BYPASS = 0(3)
4
8
MHz
frequency, mode 0
XT2 oscillator crystal
fXT2,HF1
XT2DRIVEx = 1, XT2BYPASS = 0(3)
8
16
MHz
frequency, mode 1
XT2 oscillator crystal
fXT2,HF2
XT2DRIVEx = 2, XT2BYPASS = 0(3)
16
24
MHz
frequency, mode 2
XT2 oscillator crystal
fXT2,HF3
XT2DRIVEx = 3, XT2BYPASS = 0(3)
24
32
MHz
frequency, mode 3
XT2 oscillator logic-level
fXT2,HF,SW
square-wave input
XT2BYPASS = 1(4) (3)
0.7
32
MHz
frequency, bypass mode
XT2DRIVEx = 0, XT2BYPASS = 0,
450
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
XT2DRIVEx = 1, XT2BYPASS = 0,
320
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
Oscillation allowance for
OAHF
HF crystals(5)
XT2DRIVEx = 2, XT2BYPASS = 0,
200
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
XT2DRIVEx = 3, XT2BYPASS = 0,
200
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
fOSC = 6 MHz, XT2BYPASS = 0, XT2DRIVEx = 0,
0.5
TA = 25°C, CL,eff = 15 pF
tSTART,HF
Startup time
3.0 V
ms
fOSC = 20 MHz, XT2BYPASS = 0, XT2DRIVEx = 2,
0.3
TA = 25°C, CL,eff = 15 pF
Integrated effective load
CL,eff
capacitance,
1
pF
HF mode(6) (7)
Duty cycle
Measured at ACLK, fXT2,HF2 = 20 MHz
40
50
60
%
Oscillator fault
fFault,HF
XT2BYPASS = 1(9)
30
300
kHz
frequency(8)
(1)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(2)
To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(3)
This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
(4)
When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this datasheet.
(5)
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6)
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(7)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(8)
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(9)
Measured with logic-level input frequency but also applies to operation with crystals.
56
Copyright
2009–2011, Texas Instruments Incorporated
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