参数资料
型号: MT46V32M4TG-75Z
厂商: Micron Technology, Inc.
英文描述: DOUBLE DATA RATE DDR SDRAM
中文描述: 双倍数据速率的DDR SDRAM内存
文件页数: 51/68页
文件大小: 2547K
代理商: MT46V32M4TG-75Z
51
128Mb: x4, x8, x16 DDR SDRAM
128Mx4x8x16DDR_C.p65
Rev. C; Pub. 4/01
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2001, Micron Technology, Inc.
128Mb: x4, x8, x16
DDR SDRAM
PRELIMINARY
DERATING DATA VALID WINDOW
(
t
QH -
t
DQSQ)
3.250
3.300
3.350
3.400
3.450
3.500
3.550
3.600
3.650
3.700
3.750
2.900
2.950
3.000
3.050
3.100
3.150
3.200
3.250
3.300
3.350
3.400
2.125
2.163
2.200
2.238
2.275
2.313
2.350
2.388
2.425
2.463
2.500
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
50/50
49.5/50.5
49/51
48.5/52.5
48/52
47.5/53.5
47/53
46.5/54.5
46/54
45.5/55.5
45/55
Clock Duty Cycle
n
NOTES (continued)
23. The refresh period 64ms. This equates to an
average refresh rate of 15.625μs. However, an
AUTO REFRESH command must be asserted at
least once every 140.6μs; burst refreshing or
posting by the DRAM controller greater than
eight refresh cycles is not allowed.
24. The I/O capacitance per DQS and DQ byte/
group will not differ by more than this maxi-
mum amount for any given device.
25. The valid data window is derived by achieving
other specifications -
t
HP (
t
CK/2),
t
DQSQ, and
t
QH (
t
QH =
t
HP -
t
QHS). The data valid window
derates directly porportional with the clock duty
cycle and a practical data valid window can be
derived. The clock is allowed a maximum duty
cycle variation of 45/55. Functionality is
uncertain when operating beyond a 45/55 ratio.
The data valid window derating curves are
provided below for duty cycles ranging between
50/50 and 45/55.
26. Referenced to each output group: x4 = DQS with
DQ0-DQ3; x8 = DQS with DQ0-DQ7; x16 =
LDQS with DQ0-DQ7; and UDQS with
DQ8-DQ15.
27. This limit is actually a nominal value and does
not result in a fail value. CKE is HIGH during
REFRESH command period (
t
RFC [MIN]) else
CKE is LOW (i.e., during standby).
28. To maintain a valid level, the transitioning edge
of the input must:
a) Sustain a constant slew rate from the current
AC level through to the target AC level, V
IL
(
AC
)
or V
IH
(
AC
).
b) Reach at least the target AC level.
c) After the AC target level is reached, continue
to maintain at least the target DC level, V
IL
(
DC
)
or V
IH
(
DC
).
29. The Input capacitance per pin group will not
differ by more than this maximum amount for
any given device..
30. JEDEC specifies CK and CK# input slew rate must
be
1V/ns (2V/ns differentially).
31. DQ and DM input slew rates must not deviate
from DQS by more than 10%. If the DQ/DM/
DQS slew rate is less than 0.5V/ns, timing must
be derated: 50ps must be added to
t
DS and
t
DH
for each 100mv/ns reduction in slew rate. If slew
rate exceeds 4V/ns, functionality is uncertain.
——
-75 @
t
CK = 10ns
——
-8 @
t
CK = 10ns
——
-75 @
t
CK = 7.5ns
——
-8 @
t
CK = 8ns
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