参数资料
型号: MT48LC8M16LFTG-10XT:G
元件分类: DRAM
英文描述: 8M X 16 SYNCHRONOUS DRAM, 7 ns, PDSO54
封装: 0.400 INCH, PLASTIC, TSOP2-54
文件页数: 43/79页
文件大小: 2760K
PDF: 09005aef807f4885/Source: 09005aef8071a76b
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mbx16x32Mobile_2.fm - Rev. L 10/07 EN
48
2001 Micron Technology, Inc. All rights reserved.
128Mb: x16, x32 Mobile SDRAM
Electrical Specifications
Stresses greater than those listed in Table 12 may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at these or any
other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may
affect reliability.
Temperature and Thermal Impedance
It is imperative that the Mobile SDRAM device’s temperature specifications, shown in
Table 13 on page 49, be maintained to ensure the junction temperature is in the proper
operating range to meet data sheet specifications. An important step in maintaining the
proper junction temperature is using the device’s thermal impedances correctly. The
thermal impedances are listed in Table 14 on page 49 for the applicable die revision and
packages being made available. These thermal impedance values vary according to the
density, package, and particular design used for each device.
The SDRAM device’s safe junction temperature range can be maintained when the TC
specification is not exceeded. In applications where the device’s ambient temperature is
too high, use of forced air and/or heat sinks may be required to satisfy the case tempera-
ture specifications.
Table 12:
Absolute Maximum Ratings
Parameter
Min
Max
Rating
Voltage on VDD/VDDQ supply relative to VSS (LC devices)
–1
+4.6
V
Relative to VSS (V devices)
0.5
+3.6
V
Voltage on inputs, NC or I/O pins relative to VSS (LC devices)
–1
+4.6
V
Relative to VSS (V devices)
–0.5
+3.6
V
Operating temperature
TA (commercial)
TA (industrial)
TA (extended)
0
–40
–25
+70
+85
+75
°C
Storage temperature (plastic)
–55
+150
°C
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相关代理商/技术参数
参数描述
MT48LC8M32B2 制造商:MICRON 制造商全称:Micron Technology 功能描述:SYNCHRONOUS DRAM