参数资料
型号: MTD6N15T4GV
厂商: ON Semiconductor
文件页数: 2/6页
文件大小: 0K
描述: IC NFET 150V 6A 300MO DPAK
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 150V
电流 - 连续漏极(Id) @ 25° C: 6A
开态Rds(最大)@ Id, Vgs @ 25° C: 300 毫欧 @ 3A,10V
Id 时的 Vgs(th)(最大): 4.5V @ 1mA
闸电荷(Qg) @ Vgs: 30nC @ 10V
输入电容 (Ciss) @ Vds: 1200pF @ 25V
功率 - 最大: 1.25W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: DPAK-3
包装: 带卷 (TR)
MTD6N15
ELECTRICAL CHARACTERISTICS (T J = 25 ° C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Drain ? Source Breakdown Voltage (V GS = 0 Vdc, I D = 0.25 mAdc)
Zero Gate Voltage Drain Current
(V DS = Rated V DSS , V GS = 0 Vdc)
T J = 125 ° C
Gate ? Body Leakage Current, Forward (V GSF = 20 Vdc, V DS = 0)
Gate ? Body Leakage Current, Reverse (V GSR = 20 Vdc, V DS = 0)
V (BR)DSS
I DSS
I GSSF
I GSSR
150
?
?
?
?
?
10
100
100
100
Vdc
m Adc
nAdc
nAdc
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage (V DS = V GS , I D = 1.0 mAdc)
T J = 100 ° C
Static Drain ? Source On ? Resistance (V GS = 10 Vdc, I D = 3.0 Adc)
Drain ? Source On ? Voltage (V GS = 10 Vdc)
(I D = 6.0 Adc)
(I D = 3.0 Adc, T J = 100 ° C)
Forward Transconductance (V DS = 15 Vdc, I D = 3.0 Adc)
V GS(th)
R DS(on)
V DS(on)
g FS
2.0
1.5
?
?
?
2.5
4.5
4.0
0.3
1.8
1.5
?
Vdc
W
Vdc
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(V DS = 25 Vdc, V GS = 0 Vdc, f = 1.0 MHz)
(See Figure 11)
C iss
C oss
C rss
?
?
?
1200
500
120
pF
SWITCHING CHARACTERISTICS* (T J = 100 ° C)
Turn ? On Delay Time
t d(on)
?
50
ns
Rise Time
Turn ? Off Delay Time
Fall Time
(V DD = 25 Vdc, I D = 3.0 Adc, R G = 50 W )
(See Figures 13 and 14)
t r
t d(off)
t f
?
?
?
180
200
100
Total Gate Charge
Gate ? Source Charge
Gate ? Drain Charge
(V DS = 0.8 Rated V DSS ,
I D = Rated I D , V GS = 10 Vdc)
(See Figure 12)
Q g
Q gs
Q gd
15 (Typ)
8.0 (Typ)
7.0 (Typ)
30
?
?
nC
SOURCE ? DRAIN DIODE CHARACTERISTICS*
Forward On ? Voltage
V SD
1.3 (Typ)
2.0
Vdc
Forward Turn ? On Time
(I S = 6.0 Adc, di/dt = 25 A/ m s, V GS = 0 Vdc)
t on
Limited by stray inductance
Reverse Recovery Time
t rr
325 (Typ)
?
ns
3. Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2%.
2.5
2
25
20
1.5
1
0.5
15
10
5
T C
0
0
25
50
75
100
125
150
T A
T C
T, TEMPERATURE ( ° C)
Figure 1. Power Derating
http://onsemi.com
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