参数资料
型号: MW6S010GNR1
厂商: Freescale Semiconductor
文件页数: 11/20页
文件大小: 725K
描述: MOSFET RF N-CH 28V 10W TO270-2GW
标准包装: 1
晶体管类型: LDMOS
频率: 960MHz
增益: 18dB
电压 - 测试: 28V
额定电流: 10µA
电流 - 测试: 125mA
功率 - 输出: 10W
电压 - 额定: 68V
封装/外壳: TO-270BB
供应商设备封装: TO-270 WB-4 鸥翼形
包装: 标准包装
其它名称: MW6S010GNR1DKR
MW6S010NR1 MW6S010GNR1
19
RF Device Data
Freescale Semiconductor
PRODUCT DOCUMENTATION, TOOLS AND SOFTWARE
Refer to the following documents to aid your design process.
Application Notes
?
AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
?
AN1949: Mounting Method for the MHVIC910HR2 (PFP-16) and Similar Surface Mount Packages
?
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
?
AN3789: Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages
Engineering Bulletins
?
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
?
Electromigration MTTF Calculator
?
RF High Power Model
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the ?Part Number? link. Go to the
Software & Tools tab on the part?s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
4
Dec. 2008
?
Changed Storage Temperature Range in Max Ratings table from -65 to +175 to -65 to +150 for
standardization across products, p. 1
?
Removed Total Device Dissipation from Max Ratings table as data was redundant (information already
provided in Thermal Characteristics table), p. 1
?
Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 1
?
Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related
?Continuous use at maximum temperature will affect MTTF? footnote added and changed 200°C to 225°C in
Capable Plastic Package bullet, p. 1
?
Corrected VDS
to V
DD
in the RF test condition voltage callout for V
GS(Q)
and added ?Measured in Functional
Test?, On Characteristics table, p. 2
?
Corrected Ciss
test condition to indicate AC stimulus on the V
GS
connection versus the V
DS
connection,
Dynamic Characteristics table, p. 2
?
Updated Part Numbers in Tables 6, 7, Component Designations and Values, to RoHS compliant part
numbers, p. 3, 9
?
Removed lower voltage tests from Fig. 10, Power Gain versus Output Power, due to fixed tuned fixture
limitations, p. 6
?
Replaced Fig. 12, MTTF versus Junction Temperature with updated graph. Removed Amps2
and listed
operating characteristics and location of MTTF calculator for device, p. 7
?
Replaced Case Outline 1265-08 with 1265-09, Issue K, p. 1, 13-15. Corrected cross hatch pattern in
bottom view and changed its dimensions (D2 and E3) to minimum value on source contact (D2 changed
from Min-Max .290-.320 to .290 Min; E3 changed from Min-Max .150-.180 to .150 Min). Added JEDEC
Standard Package Number.
?
Replaced Case Outline 1265A-02 with 1265A-03, Issue C, p. 1, 16-18. Corrected cross hatch pattern and
its dimensions (D2 and E2) on source contact (D2 changed from Min-Max .290-.320 to .290 Min; E3
changed from Min-Max .150-.180 to .150 Min). Added pin numbers. Corrected mm dimension L for
gull-wing foot from 4.90-5.06 Min-Max to 0.46-0.61 Min-Max. Added JEDEC Standard Package Number.
?
Added Product Documentation and Revision History, p. 19
5
June 2009
?
Modified data sheet to reflect MSL rating change from 1 to 3 as a result of the standardization of packing
process as described in Product and Process Change Notification number, PCN13516, p. 2
?
Added AN3789, Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages to
Product Documentation, Application Notes, p. 19
?
Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software, p. 19
相关PDF资料
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