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参数资料
| 型号： | NAND512W3A2DZA6T |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 64M X 8 FLASH 3V PROM, 12000 ns, PBGA63 |
| 封装： | 8.50 X 15 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 |
| 文件页数： | 4/5页 |
| 文件大小： | 150K |
| 代理商： | NAND512W3A2DZA6T |
4/5
PART NUMBERING
Table 3. Ordering Information Scheme
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to ’1’.
For further information on any aspect of this device, please contact your nearest ST Sales Office.
Example:
NAND512R3A
0
A ZA
1
T
Device Type
NAND Flash Memory
Density
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
Operating Voltage
R = VCC = 1.65 to 1.95V
W = VCC = 2.7 to 3.6V
Bus Width
3 = x8
4 = x16
Family Identifier
A = 528 Bytes/ 264 Word Page
Options
0 = normal
1 = Read Page0 at Power-up
2 = Chip Enable Don’t Care
3 = Chip Enable Don’t Care Enabled and Read Page0 at Power-up
Silicon Version
A, B, C, D
Package
N = TSOP48 12 x 20mm
ZA = VFBGA63 9 x 11x1mm, 6x8 ball array, 0.8mm pitch (128Mbit and 256Mbit devices)
ZA = VFBGA63 8.5 x 15x1mm, 6x8 ball array, 0.8mm pitch (512Mbit devices)
ZA = TFBGA63 8.5 x 15x1.2mm, 6x8 ball array, 0.8mm pitch (1Gbit devices)
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
blank = Standard Packing
T = Tape & Reel Packing
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel Packing
相关PDF资料 |
PDF描述 |
|---|---|
| NAND512W4A0DN1F | 32M X 16 FLASH 3V PROM, 12000 ns, PDSO48 |
| NAND512W4A2DN6F | 32M X 16 FLASH 3V PROM, 12000 ns, PDSO48 |
| NAND512W4A3CZA1T | 32M X 16 FLASH 3V PROM, 12000 ns, PBGA63 |
| NAND02GW4B3AN6T | 128M X 16 FLASH 3V PROM, 35 ns, PDSO48 |
| NAND02GW4B3BN1 | 128M X 16 FLASH 3V PROM, 35 ns, PDSO48 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NAND512W3A2SE06 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512W3A2SN6E | 功能描述:IC FLASH 512MBIT 48TSOP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G（256M x 16） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6 |
| NAND512W3A2SN6F | 制造商:Micron Technology Inc 功能描述:512MB NAND FLASH 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel |
| NAND512W3A2SZA6E | 制造商:Micron Technology Inc 功能描述:SLC NAND Flash Parallel 3V/3.3V 512Mbit 64M x 8bit 12us 63-Pin VFBGA Tray 制造商:Micron Technology Inc 功能描述:NAND - Trays 制造商:Micron Technology Inc 功能描述:MICNAND512W3A2SZA6E 512MB NAND FLASH 制造商:Micron Technology 功能描述:SLC NAND Flash Parallel 3V/3.3V 512Mbit 64M x 8bit 12us 63-Pin VFBGA Tray |
| NAND512W3A2SZA6F | 制造商:Micron Technology Inc 功能描述:SLC NAND Flash Parallel 3V/3.3V 512Mbit 64M x 8bit 12us 63-Pin VFBGA T/R 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel 制造商:Micron Technology 功能描述:SLC NAND Flash Parallel 3V/3.3V 512Mbit 64M x 8bit 12us 63-Pin VFBGA T/R |
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