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| 型号： | NCN8024DWR2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 14/16页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD IC2 28SOIC |
| 标准包装： | 1,000 |
| 应用： | 智能卡读取器，写入器 |
| 电源电压： | 5V |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 28-SOIC W |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
| 其它名称： | NCN8024DWR2G-ND NCN8024DWR2GOSTR |
NCN8024
http://onsemi.com
7
POWER SUPPLY SECTION (VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 10 MHz)
Pin
Unit
Max
Typ
Min
Rating
Symbol
DC/DC CONVERTER
17
CRD_VCC
Output Card Supply Voltage @ 3.6 V v VDDP v 5.5 V with |ICC| v
65 mA load transient from 100 Hz to 200 MHz (including ripple)
(Note 4)
CRD_VCC = 3.0 V
CRD_VCC = 5.0 V
2.76
4.65
3.00
5.00
3.20
5.25
V
17
CRD_VCC
Output Card Supply Voltage @ 4.5 V< VDDP < 5.5 V with Current
Load Pulses of 40 nAs/t < 400 ns and |ICC| < 200 mA Peak Current
(Including Ripple) (Note 4)
CRD_VCC = 3.0 V
CRD_VCC = 5.0 V
2.76
4.65
3.00
5.00
3.20
5.25
V
17
ICRD_VCC
Card Supply Current
@ CRD_VCC = 3.0 V
@ CRD_VCC = 5.0 V
75
mA
17
ICRD_VCC_SC ShortCircuit Current CRD_VCC Shorted to Ground
110
150
mA
17
DVCRD_VCC
Output Card Supply Voltage Ripple PeaktoPeak fripple = 100 Hz to
200 MHz (Load Transient with 65 mA Peak Current) (Note 4)
350
mV
17
0.22
V/ms
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
4. Guaranteed by design and characterization
5. These values take into account the tolerance of the cms capacitor used. The allowed values are single or distributed capacitor combination
not exceeding 1.0 mF with 220 nF + 330 nF typical and recommended. It is recommended to use X5R or X7Rtype capacitors with very
low ESR (< 100 mW) for optimal performances.
DIGITAL INPUT/OUTPUT SECTION CLKIN, RSTIN, I/Ouc, AUX1uc, AUX2uc, CLKDIV1, CLKDIV2, CMDVCC, 5V/3V
(VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 10 MHz)
Pin
Symbol
Rating
Min
Typ
Max
Unit
24
27
MHz
1, 2, 3, 19,
20, 24, 26,
27, 28
VIL
Input Voltage Level Low: CLKIN, RSTIN, I/Ouc, AUX1uc, AUX2uc,
CLKDIV1, CLKDIV2, CMDVCC, 5V/3V
0.3
0.3 x VDD
V
1, 2, 3, 19,
20, 24, 26,
27, 28
VIH
Input Voltage Level High: CLKIN, RSTIN, I/O, AUX1, AUX2,
CLKDIV1, CLKDIV2, CMDVCC, 5V/3V
0.7 x VDD
VDD + 0.3
V
1, 2, 3, 19,
20, 24
IIL
CLKDIV1, CLKDIV2, CMDVCC, RSTIN, CLKIN, 5V/3V Low Level
Input Leakage Current, VIL = 0 V
1.0
mA
1, 2, 3, 19,
20, 24
IIH
CLKDIV1, CLKDIV2, CMDVCC, RSTIN, CLKIN, 5V/3V Low Level
Input Leakage Current, VIH = VDD
1.0
mA
26, 27, 28
IIL
I/Ouc, AUX1uc, AUX2uc Low Level Input Leakage Current, VIL = 0 V
600
mA
26, 27, 28
IIH
I/Ouc, AUX1uc, AUX2uc High Level Input Leakage Current, VIH = VDD
10
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
6. Guaranteed by design and characterization
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