参数资料
| 型号： | NCP1031POEEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 17/19页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL NCP1031 POE DC CONV |
| 设计资源： | NCP1031POEEVB Schematic NCP1031POEEVB Gerber Files NCP1031POEEVB Bill of Materials |
| 标准包装： | 1 |
| 主要目的： | 电源管理，以太网供电（POE） |
| 嵌入式： | 否 |
| 已用 IC / 零件： | NCP1031 |
| 已供物品： | 板 |
| 其它名称： | NCP1031POEEVB-ND NCP1031POEEVBOS |
NCP1030, NCP1031
PACKAGE DIMENSIONS
8 PIN DFN, 4x4
CASE 488AF--01
ISSUE C
2X
PIN ONE
REFERENCE
0.15 C
D
A
B
E
L1
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL
CONSTRUCTIONS FOR TERMINALS.
8X
2X 0.15 C
0.10 C
0.08 C
NOTE 4
TOP VIEW
DETAIL B
(A3)
SIDE VIEW
A1
A
C
EXPOSED Cu
SEATING
PLANE
MOLD CMPD
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN MAX
0.80 1.00
0.00 0.05
0.20 REF
0.25 0.35
4.00 BSC
1.91 2.21
4.00 BSC
2.09 2.39
0.80 BSC
0.20 ------
0.30 0.50
------ 0.15
DETAIL A
1
D2
4
8X
L
SOLDERING FOOTPRINT*
2.21
8X
0.63
E2
K
e
8
5
8X
b
0.10 C A B
0.05 C NOTE 3
4.30 2.39
PACKAGE
OUTLINE
BOTTOM VIEW
0.80
PITCH
8X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
17
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