参数资料
型号: NCP3065BBGEVB
厂商: ON Semiconductor
文件页数: 17/18页
文件大小: 0K
描述: BOARD EVAL NCP3065 MR16 BOOST
设计资源: NCP3065BBGEVB Schematic
NCP3065BBGEVB Gerber Files
NCP3065BBGEVB Bill of Materials
标准包装: 1
电流 - 输出 / 通道: 350mA
输出及类型: 1,非隔离
输出电压: 8 ~ 12 V
输入电压: 6 ~ 16 V 或 12VAC
已供物品:
已用 IC / 零件: NCP3065
其它名称: NCP3065BBGEVB-ND
NCP3065BBGEVBOS
NCP3065, NCV3065
PACKAGE DIMENSIONS
? Y ?
B
? X ?
8
1
A
5
4
S
0.25 (0.010)
M
Y
SOIC ? 8 NB
CASE 751 ? 07
ISSUE AH
M
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751 ? 01 THRU 751 ? 06 ARE OBSOLETE. NEW
STANDARD IS 751 ? 07.
G
MILLIMETERS
INCHES
? Z ?
H
D
0.25 (0.010)
M
Z Y
C
S
X
SEATING
PLANE
0.10 (0.004)
S
N
X 45 _
M
J
DIM
A
B
C
D
G
H
J
K
M
N
S
MIN MAX
4.80 5.00
3.80 4.00
1.35 1.75
0.33 0.51
1.27 BSC
0.10 0.25
0.19 0.25
0.40 1.27
0 _ 8 _
0.25 0.50
5.80 6.20
MIN MAX
0.189 0.197
0.150 0.157
0.053 0.069
0.013 0.020
0.050 BSC
0.004 0.010
0.007 0.010
0.016 0.050
0 _ 8 _
0.010 0.020
0.228 0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
0.6
0.024
4.0
0.155
1.270
0.050
SCALE 6:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
17
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