参数资料
型号: NCP4331DBR2G
厂商: ON Semiconductor
文件页数: 21/22页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM 16-TSSOP
产品变化通告: Product Obsolescence 19/Dec/2008
标准包装: 2,500
PWM 型: 控制器
输出数: 2
频率 - 最大: 400kHz
电源电压: 最高 30V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
包装: 带卷 (TR)
NCP4331
PACKAGE DIMENSIONS
TSSOP-16
CASE 948F-01
ISSUE B
16X K REF
0.10 (0.004)
M
T U
S
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
0.15 (0.006) T U
S
K
K1
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
2X
L/2
16
9
J1
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
L
PIN 1
IDENT.
1
8
B
-U-
J
N
SECTION N-N
0.25 (0.010)
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
M
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
0.15 (0.006) T U
S
A
-V-
N
DIM
A
MILLIMETERS
MIN MAX
4.90 5.10
INCHES
MIN MAX
0.193 0.200
F
DETAIL E
B
C
D
F
G
H
4.30 4.50
--- 1.20
0.05 0.15
0.50 0.75
0.65 BSC
0.18 0.28
0.169 0.177
--- 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007 0.011
0.10 (0.004)
C
-W-
J
J1
K
K1
0.09 0.20
0.09 0.16
0.19 0.30
0.19 0.25
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
-T- SEATING
PLANE
D
G
H
DETAIL E
L
M
6.40 BSC
0 _ 8 _
0.252 BSC
0 _ 8 _
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
21
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