参数资料
型号: NCV8881PWR2G
厂商: ON Semiconductor
文件页数: 3/33页
文件大小: 321K
描述: IC REG TRPL BUCK/LINEAR 16SOIC
标准包装: 1
拓扑: 降压(降压)(1),线性(LDO)(2)
功能: 车载
输出数: 3
频率 - 开关: 170kHz
电压/电流 - 输出 1: 3.3 V ~ 8 V,1.5A
电压/电流 - 输出 2: 5V,100mA
电压/电流 - 输出 3: 8.5V,40mA
带 LED 驱动器:
带监控器:
带序列发生器:
电源电压: 5 V ~ 19 V
工作温度: -40°C ~ 150°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)裸露焊盘
供应商设备封装: 16-SOIC W
包装: 标准包装
其它名称: NCV8881PWR2GOSDKR
NCV8881
http://onsemi.com
3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Min/Max Voltage on WDI
0.3 to 7
V
Min/Max Voltage on RDLY
0.3 to 7
V
Min/Max Voltage on RESB
0.3 to 7
V
Min/Max Voltage on EN
0.3 to 10
V
Max EN Current
10
mA
Min EN Current (with zero VIN voltage)
10
mA
Min/Max Voltage on SYNC
0.3 to 7
V
Min/Max Voltage on ROSC
0.3 to 7
V
Min/Max Voltage COMP
0.3 to 7
V
Min/Max Voltage FB
0.3 to 7
V
Min Voltage SW
 DC
 20 ns
0.7
3
V
Max Voltage VIN to SW
40
V
Max Voltage VIN
40
V
Min/Max Voltage BST
0.3 to 30
V
Min/Max Voltage BST to SW
0.3 to 15
V
Min/Max Voltage on 8P5
0.3 to 9.5
V
Max 8P5 Current
70
mA
Min/Max Voltage on LDOMON
0.3 to 7
V
Min/Max Voltage on 5P0
0.3 to 7
V
Min/Max Voltage IGNBUF
0.3 to 7
V
Storage Temperature range
55 to +150
Operating Junction Temperature Range
T
J
40 to + 150
ESD withstand Voltage Human Body Model
Machine Model
Charged Device Model
V
ESD
2.0
200
>1.0
kV
V
kV
Moisture Sensitivity
MSL
Level 1
Peak Reflow Soldering Temperature
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Parameter
Board/Mounting Conditions Typical Value
Unit
Minimum Pad (Note 1)
1 sq. inch (Note 2)
Junctiontocase top (Y
JT
, q
JT
)
30
16
癈/W
Junctiontopin 1(Y
JL1
, q
JL1
)
70
65
癈/W
Junctiontoboard (Y
JB
, q
JB
) (Note 3)
15
17
癈/W
Junctiontoambient (R
qJA
, q
JA
)
150
55
癈/W
Specific Notes on Thermal Characterization Conditions:
NOTE: All boards are 0.062 thick FR4, 3 square, with varying amounts of copper heat spreader, in still air (free convection) conditions.
Numerical values are derived from an axisymmetric finiteelement model where active die area, total die area, flag area, pad area,
and board area are equated to the actual corresponding areas.
1. 1 oz. copper, 17.2 mm
2
 spreader area (minimum exposed pad, not including traces which are assumed).
2. 1 oz. copper, 645 mm
2
 (1 in
2
) spreader area (includes exposed pad).
3. Board is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it
best represents the primary heat flow path and is least sensitive to board and ambient properties.
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