参数资料
型号: NE1617ADS,112
厂商: NXP Semiconductors
文件页数: 14/30页
文件大小: 305K
描述: IC TEMP MONITOR 16SSOP
标准包装: 100
功能: 温度监控系统(传感器)
传感器类型: 内部和外部
感应温度: -55°C ~ 125°C,外部传感器
精确度: ±3°C 本地(最大),±5°C 远程(最大)
拓扑: ADC,多路复用器,寄存器库
输出类型: SMBus?
输出警报:
输出风扇:
电源电压: 3 V ~ 5.5 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
供应商设备封装: 16-SSOP
包装: 管件
其它名称: 935268119112
NE1617ADS
NE1617ADS-ND
NE1617A
All information provided in this document is subject to legal disclaimers.
?NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5  20 March 2012
14 of 30
NXP Semiconductors
NE1617A
Temperature monitor for microprocessor systems
 
9.1.2   Thermal inertia and self-heating
Accuracy depends on the temperature of the remote-sensing diode and/or the internal
temperature sensor being at the same temperature as that being measured, and a
number of factors can affect this. Ideally, the sensor should be in good thermal contact
with the part of the system being measured, for example, the processor. If it is not, the
thermal inertia caused by the mass of the sensor causes a lag in the response of the
sensor to a temperature change. In the case of the remote sensor, this should not be a
problem, since it is either a substrate transistor in the processor or a small package
device, such as the SOT23, placed in close proximity to it.
The on-chip sensor, however, is often remote from the processor and is only monitoring
the general ambient temperature around the package. The thermal time constant of the
SSOP16 package in still air is about 140 seconds, and if the ambient air temperature
quickly changed by 100 癈, it would take about 12 minutes (five time constants) for the
junction temperature of the NE1617A to settle within 1 癈 of this. In practice, the
NE1617A package is in electrical and therefore thermal contact with a printed-circuit
board and can also be in a forced airflow. How accurately the temperature of the board
and/or the forced airflow reflect the temperature to be measured also affects the accuracy.
Self-heating due to the power dissipated in the NE1617A or the remote sensor causes the
chip temperature of the device or remote sensor to rise above ambient. However, the
current forced through the remote sensor is so small that self-heating is negligible. In the
case of the NE1617A, the worst-case condition occurs when the device is converting at
16 conversions per second while sinking the maximum current of 1 mA at the ALERT
 
output. In this case, the total power dissipation in the device is about 11 mW. The thermal
resistance, R
th(j-a)
, of the SSOP16 package is about 121 癈/W.
In practice, the package has electrical and therefore thermal connection to the printed
circuit board, so the temperature rise due to self-heating is negligible.
Table 11.    Representative diodes for temperature sensing
Manufacturer
Model number
Rohm
UMT3904
Diodes Inc.
MMBT3904-7
Philips
MMBT3904
ST Micro
MMBT3904
ON Semiconductor
MMBT3904LT1
Chenmko
MMBT3904
Infineon Technologies
SMBT3904E6327
Fairchild Semiconductor
MMBT3904FSCT
National Semiconductor
MMBT3904N623
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