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| 型号： | NE1617ADS,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 25/30页 |
| 文件大小： | 305K |
| 描述： | IC TEMP MONITOR 16SSOP |
| 标准包装： | 100 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部和外部 |
| 感应温度： | -55°C ~ 125°C，外部传感器 |
| 精确度： | ±3°C 本地（最大），±5°C 远程（最大） |
| 拓扑： | ADC，多路复用器，寄存器库 |
| 输出类型： | SMBus? |
| 输出警报： | 是 |
| 输出风扇： | 无 |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SSOP |
| 包装： | 管件 |
| 其它名称： | 935268119112 NE1617ADS NE1617ADS-ND |
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NE1617A
All information provided in this document is subject to legal disclaimers.
?NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 20 March 2012
25 of 30
NXP Semiconductors
NE1617A
Temperature monitor for microprocessor systems
13.4 Reflow soldering
Key characteristics in reflow soldering are:
" Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 15
) than a SnPb process, thus
reducing the process window
" Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
" Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16
and 17
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 15
.
Table 16. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
?SPAN class="pst NE1617ADS-112_2299546_10"> 350
< 2.5
235
220
?2.5
220
220
Table 17. Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
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| NE1617DS | 功能描述:板上安装温度传感器 I2C LOC +/- 2OC AND REM +/- 3OC TS RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| NE1617DS,112 | 功能描述:板上安装温度传感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| NE1617DS,118 | 功能描述:板上安装温度传感器 I2C LOC +/- 2OC AND REM +/- 3OC TS RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| NE1618 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Temperature monitor for microprocessor systems |
| NE1618DS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Temperature monitor for microprocessor systems |
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