参数资料
型号: NILMS4501NR2G
厂商: ON Semiconductor
文件页数: 8/9页
文件大小: 0K
描述: IC MOSF N-CH 9.5A 24V ESD 4-PLLP
产品变化通告: Product Obsolescence 14/Apr/2010
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 电流感测
漏极至源极电压(Vdss): 24V
电流 - 连续漏极(Id) @ 25° C: 9.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 13 毫欧 @ 6A,10V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 25nC @ 10V
输入电容 (Ciss) @ Vds: 1500pF @ 6V
功率 - 最大: 1.4W
安装类型: 表面贴装
封装/外壳: 4-DFN
供应商设备封装: 4-PLLP
包装: 剪切带 (CT)
其它名称: NILMS4501NR2GOSCT
NILMS4501N
20
16
12
8
4
0
V GS = 0 V
T J = 25 ° C
0.4
0.5
0.6
0.7
0.8
0.9
1
V SD , SOURCE?TO?DRAIN VOLTAGE (VOLTS)
Figure 16. Diode Forward Voltage versus Current
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain?to?source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (T C ) of 25 ° C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance ?
General Data and Its Use.”
Switching between the off?state and the on?state may
traverse any load line provided neither rated peak current
(I DM ) nor rated voltage (V DSS ) is exceeded, and that the
transition time (t r , t f ) does not exceed 10 m s. In addition the
total power averaged over a complete switching cycle must
not exceed (T J(MAX) ? T C )/(R q JC ).
A power MOSFET designated E?FET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and must be adjusted for operating
conditions differing from those specified. Although industry
practice is to rate in terms of energy, avalanche energy
capability is not a constant. The energy rating decreases
non?linearly with an increase of peak current in avalanche
and peak junction temperature.
1000
100
10
Mounted on 2 ″ sq. FR4 board (1 ″ sq. 2 oz. Cu 0.06 ″
thick single sided) with one die operating, 10s max.
V GS = 10 V
SINGLE PULSE
T C = 25 ° C
10 m s
60
50
40
30
I D = 9.5 A
100 m s
20
1
1 ms
R DS(on) LIMIT
THERMAL LIMIT
10 ms
10
0.1
0.1
PACKAGE LIMIT
1
10
dc
100
0
25
50
75
100
125
150
175
V DS , DRAIN?TO?SOURCE VOLTAGE (VOLTS)
Figure 17. Maximum Rated Forward Biased
Safe Operating Area
T J , STARTING JUNCTION TEMPERATURE ( ° C)
Figure 18. Maximum Avalanche Energy versus
Starting Junction Temperature
http://onsemi.com
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