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| 型号： | NIS5112D1R2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 9/9页 |
| 文件大小： | 410K |
| 描述： | IC ELECTRONIC FUSE HOTSWAP 8SOIC |
| 标准包装： | 1 |
| 功能： | 电子保险丝 |
| 输入电压： | 9 V ~ 18 V |
| 电流 - 输出： | 2A |
| 工作温度： | -40°C ~ 175°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 剪切带 (CT) |
| 其它名称： | NIS5112D1R2GOSCT |
NIS5112
http://onsemi.com
9
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AJ
SEATING
PLANE
1
4
5
8
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN
MAX
MIN
MAX
INCHES
4.80
5.00 0.189
0.197
MILLIMETERS
B
3.80
4.00 0.150
0.157
C
1.35
1.75 0.053
0.069
D
0.33
0.51 0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25 0.004
0.010
J
0.19
0.25 0.007
0.010
K
0.40
1.27 0.016
0.050
M
0
8
0
8
N
0.25
0.50 0.010
0.020
S
5.80
6.20 0.228
0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010)
Z
S
X
S
M
_
_
_
_
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
mm
inches
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
NIS5112/D
SENSEFET is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
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