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| 型号： | NRVBS360T3G |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/7页 |
| 文件大小： | 111K |
| 描述： | DIODE SCHOTTKY 3A 60V SMC |
| 标准包装： | 2,500 |
| 二极管类型： | 肖特基 |
| 电压 - (Vr)（最大）： | 60V |
| 电流 - 平均整流 (Io)： | 3A |
| 电压 - 在 If 时为正向 (Vf)（最大）： | 740mV @ 3A |
| 速度： | 快速恢复 =< 500 ns，> 200mA（Io） |
| 电流 - 在 Vr 时反向漏电： | 150µA @ 60V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | DO-214AB，SMC |
| 供应商设备封装： | SMC |
| 包装： | 带卷 (TR) |
MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
http://onsemi.com
2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
RRM
RWM
VR
60
V
Average Rectified Forward Current
IF(AV)
3.0 @ TL
= 137
°C
4.0 @ TL
= 127
°C
A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
125
A
Storage Temperature Range
Tstg
?
65 to +175
°C
Operating Junction Temperature (Note 1)
TJ
?
65 to +175
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction?to?Ambient: dPD/dTJ
< 1/R
JA.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction?to?Lead (Note 2)
SMC Package
SMB Package
RJL
11
15
°C/W
Thermal Resistance, Junction?to?Ambient (Note 2)
SMC Package
SMB Package
RJA
136
145
°C/W
Thermal Resistance, Junction?to?Ambient (Note 3)
SMC Package
SMB Package (Note 4)
RJA
71
73
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 5)
(iF
= 3.0 A, T
J
= 25
°C)
VF
0.63
V
Maximum Instantaneous Reverse Current (Note 5)
(Rated dc Voltage, TJ
= 25
°C)
(Rated dc Voltage, TJ
= 100
°C)
iR
0.03
3.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise
noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Mounted with minimum recommended pad size, PC Board FR4.
3. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
4. Typical Value; 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
5. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤
2.0%.
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
I
F
, INSTANTANEOUS FORWARD
CURRENT (A)
TJ
= 25
°C
TJ
= 150
°C
TJ
= 100
°C
TJ
=
?40°C
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
TJ
= 25
°C
TJ
= 150
°C
TJ
= 100
°C
TJ
=
?40°C
0.010.0 0.2 0.4 0.6 0.8
0.1
1
10
TJ
= 175
°C
0.010.0 0.2 0.4 0.6 0.8
0.1
1
10
I
F
, INSTANTANEOUS FORWARD
CURRENT (A)
TJ
= 175
°C
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