参数资料
型号: NTA4151PT1
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET P-CH 20V 760MA SOT-416
产品变化通告: LTB Notification 03/Jan/2008
标准包装: 3,000
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 760mA
开态Rds(最大)@ Id, Vgs @ 25° C: 360 毫欧 @ 350mA,4.5V
Id 时的 Vgs(th)(最大): 450mV @ 250µA
闸电荷(Qg) @ Vgs: 2.1nC @ 4.5V
输入电容 (Ciss) @ Vds: 156pF @ 5V
功率 - 最大: 301mW
安装类型: 表面贴装
封装/外壳: SC-75,SOT-416
供应商设备封装: SC-75,SOT-416
包装: 带卷 (TR)
NTA4151P, NTE4151P
Small Signal MOSFET
? 20 V, ? 760 mA, Single P ? Channel,
Gate Zener, SC ? 75, SC ? 89
Features
? Low R DS(on) for Higher Efficiency and Longer Battery Life
? Small Outline Package (1.6 x 1.6 mm)
? SC ? 75 Standard Gullwing Package
? ESD Protected Gate
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
V (BR)DSS
? 20 V
http://onsemi.com
R DS(on) TYP
0.26 W @ ? 4.5 V
0.35 W @ ? 2.5 V
0.49 W @ ? 1.8 V
I D MAX
? 760 mA
Applications
?
?
?
?
High Side Load Switch
DC ? DC Conversion
Small Drive Circuits
Battery Operated Systems such as Cell Phones, PDAs, Digital
Cameras, etc.
P ? Channel MOSFET
D
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter Symbol
Value
Units
G
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
? 20
± 6.0
V
V
S
Continuous Drain Current
(Note 1)
Power Dissipation (Note 1)
SC ? 75
SC ? 89
Steady State
Steady State
I D
P D
? 760
301
313
mA
mW
3
MARKING DIAGRAM
& PIN ASSIGNMENT
Pulsed Drain Current tp =10 m s
Operating Junction and Storage Temperature
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
Gate ? to ? Source ESD Rating ?
(Human Body Model, Method 3015)
I DM
T J ,
T STG
I S
T L
ESD
± 1000
? 55 to
150
? 250
260
1800
mA
° C
mA
° C
V
2
1
SC ? 75 / SOT ? 416
CASE 463
STYLE 5
3
2
1
SC ? 89
3
Drain
xx M G
G
1 2
Gate Source
THERMAL RESISTANCE RATINGS
Junction ? to ? Ambient ? Steady State (Note 1) R q JA ° C/W
SC ? 75 415
SC ? 89 400
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
CASE 463C
xx = Device Code
M = Date Code*
G = Pb ? Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2013
August, 2013 ? Rev. 7
1
Publication Order Number:
NTA4151P/D
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