参数资料
型号: NTD5862NT4G
厂商: ON Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH 60V 90A DPAK
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 90A
开态Rds(最大)@ Id, Vgs @ 25° C: 5.7 毫欧 @ 45A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 82nC @ 10V
输入电容 (Ciss) @ Vds: 6000pF @ 25V
功率 - 最大: 115W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: DPAK-3
包装: 带卷 (TR)
其它名称: NTD5862NT4G-ND
NTD5862NT4GOSTR
NTD5862N, NTP5862N
N-Channel Power MOSFET
60 V, 98 A, 5.7 m W
Features
? Low R DS(on)
? High Current Capability
? 100% Avalanche Tested
? These Devices are Pb ? Free, Halogen Free and are RoHS Compliant
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
60 V
http://onsemi.com
R DS(on) MAX
5.7 m W @ 10 V
D
I D MAX
98 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
60
Unit
V
Gate ? to ? Source Voltage ? Continuous
Gate ? to ? Source Voltage
? Non ? Repetitive (t p < 10 m s)
V GS
V GS
" 20
" 30
V
V
G
Continuous Drain Cur-
rent (R q JC ) (Note 1)
Power Dissipation
(R q JC )
Steady
State
T C = 25 ° C
T C = 100 ° C
T C = 25 ° C
I D
P D
98
69
115
A
W
S
N ? CHANNEL MOSFET
4
4
Pulsed Drain Current
t p = 10 m s
I DM
335
A
4
3
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy (L = 0.3 mH)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J , T stg
I S
E AS
T L
? 55 to
175
96
205
260
° C
A
mJ
° C
1 2
3
DPAK
CASE 369C
(Surface Mount)
STYLE 2
1
2
DPAK
CASE 369D
(Straight Lead)
STYLE 2
1
2
3
TO ? 220AB
CASE 221A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MARKING DIAGRAMS
& PIN ASSIGNMENT
STYLE 5
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol
Junction ? to ? Case (Drain)
R q JC
Value
1.3
Unit
° C/W
4
Drain
4
Drain
4
Drain
Junction ? to ? Ambient ? Steady State (Note 2) R q JA
1. Limited by package to 50 A continuous.
2. Surface ? mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [2 oz] including traces.
37
2
1 Drain 3
Gate Source
1
Gate
1 2 3
Gate Drain Source
NTP
5862NG
AYWW
2
3
Source
A
Y
WW
5862N
G
= Assembly Location
= Year
= Work Week
= Device Code
= Pb ? Free Package
Drain
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2012
July, 2012 ? Rev. 2
1
Publication Order Number:
NTD5862N/D
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