参数资料
型号: NTD78N03-1G
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 25V 11.4A IPAK
产品变化通告: Product Discontinuation 01/Oct/2008
标准包装: 75
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 25V
电流 - 连续漏极(Id) @ 25° C: 11.4A
开态Rds(最大)@ Id, Vgs @ 25° C: 6 毫欧 @ 78A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 35nC @ 4.5V
输入电容 (Ciss) @ Vds: 2250pF @ 12V
功率 - 最大: 1.4W
安装类型: 通孔
封装/外壳: TO-251-3 短引线,IPak,TO-251AA
供应商设备封装: I-Pak
包装: 管件
NTD78N03
Power MOSFET
25 V, 78 A, Single N?Channel, DPAK
Features
? Low R DS(on)
? Optimized Gate Charge
? Pb?Free Packages are Available
http://onsemi.com
Applications
? Desktop VCORE
? DC?DC Converters
? Low Side Switch
V (BR)DSS
25 V
R DS(on) TYP
4.6 @ 10 V
6.5 @ 4.5 V
D
I D MAX
78 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Drain?to?Source Voltage
Gate?to?Source Voltage
Symbol
V DSS
V GS
Value
25
" 20
Unit
V
V
G
N?Channel
Continuous Drain
Current (Note 1)
T C = 25 ° C
T C = 85 ° C
I D
14.8
11.5
A
S
Power Dissipation
T C = 25 ° C
P D
2.3
W
4
4
(Note 1)
4
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Continuous Drain
Current (R q JC )
Power Dissipation
Steady
State
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
I D
P D
I D
P D
11.4
8.8
1.4
78
56
64
A
W
A
W
1 2
3
CASE 369AA
DPAK
(Bend Lead)
STYLE 2
1
2
3
CASE 369D
DPAK
(Straight Lead)
STYLE 2
1
2 3
CASE 369AD
IPAK
(Straight Lead)
(R q JC )
Pulsed Drain Current        t p = 10 m s
Current Limited by Package     T A = 25 ° C
Drain to Source dV/dt
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain?to?Source Avalanche
Energy (V DD = 24 V, V GS = 10 V,
L = 5.0 mH, I L (pk) = 17 A, R G = 25 W )
I DM
I DmaxPkg
dV/dt
T J , T stg
I S
E AS
210
45
8.0
?55 to 175
78
722.5
A
A
V/ns
° C
A
mJ
4
Drain
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
1 Drain 3
Gate Source Gate Drain Source
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 seconds)
THERMAL RESISTANCE
Junction?to?Case (Drain)
T L
R q JC
260
1.95
° C
° C/W
2
1 2 3
1 2 3
Gate Drain Source
Junction?to?Ambient ? Steady State (Note 1)
Junction?to?Ambient ? Steady State (Note 2)
R q JA
R q JA
65
110
Y
WW
78N03
= Year
= Work Week
= Device Code
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
G
= Pb?Free Package
Recommended Operating Conditions may affect device reliability.
1. Surface?mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces).
2. Surface?mounted on FR4 board using the minimum recommended pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2006
September, 2006 ? Rev. 6
1
Publication Order Number:
NTD78N03/D
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