参数资料
型号: NTMS4807NR2G
厂商: ON Semiconductor
文件页数: 4/5页
文件大小: 0K
描述: MOSFET N-CH 30V 9.1A 8-SOIC
产品变化通告: Wire Change 29/Aug/2008
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 9.1A
开态Rds(最大)@ Id, Vgs @ 25° C: 6.1 毫欧 @ 14.8A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 24nC @ 4.5V
输入电容 (Ciss) @ Vds: 2900pF @ 24V
功率 - 最大: 860mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
NTMS4807N
TYPICAL PERFORMANCE CURVES
4200
T J = 25 ° C
10
9
QT
20
3500
C iss
V GS = 0 V
8
V DS
16
2800
2100
7
6
5
V GS
12
1400
C oss
4
3
Q GS
Q GD
8
700
0
C rss
2
1
0
I D = 14.8 A
T J = 25 ° C
4
0
0
5 10
15
20
25
30
0
5
10 15
20
25
30
35
40
45
50
1000
DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 7. Capacitance Variation
6
Q G , TOTAL GATE CHARGE (nC)
Figure 8. Gate-To-Source and
Drain-To-Source Voltage vs. Total Charge
V DD = 24 V
I D = 6.1 A
V GS = 10 V
t d(off)
5
V GS = 0 V
T J = 25 ° C
100
t f
4
3
t r
2
t d(on)
1
10
1
10
100
0
0.4
0.5
0.6
0.7
0.8
100
R G , GATE RESISTANCE (OHMS)
Figure 9. Resistive Switching Time
Variation vs. Gate Resistance
10 m s
100
V SD , SOURCE-TO-DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage vs. Current
I D = 14 A
10
100 m s
1 ms
75
1
V GS = 20 V
SINGLE PULSE
10 ms
50
0.1
T C = 25 ° C
R DS(on) LIMIT
THERMAL LIMIT
dc
25
0.01
0.1
PACKAGE LIMIT
1
10
100
0
25
50 75 100
125
150
V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
http://onsemi.com
4
T J , STARTING JUNCTION TEMPERATURE ( ° C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
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