参数资料
型号: NTMSD3P102R2G
厂商: ON Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: MOSFET P-CH 20V 2.34A 8-SOIC
产品变化通告: Product Discontinuation 04/April/2008
Wire Change 12/May/2009
标准包装: 2,500
系列: FETKY™
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 二极管(隔离式)
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.34A
开态Rds(最大)@ Id, Vgs @ 25° C: 85 毫欧 @ 3.05A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 25nC @ 10V
输入电容 (Ciss) @ Vds: 750pF @ 16V
功率 - 最大: 730mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
其它名称: NTMSD3P102R2GOS
NTMSD3P102R2
FETKY ?
P-Channel Enhancement-Mode
Power MOSFET and Schottky Diode
Dual SO-8 Package
Features
? High Efficiency Components in a Single SO-8 Package
? High Density Power MOSFET with Low R DS(on) ,
Schottky Diode with Low V F
? Independent Pin-Outs for MOSFET and Schottky Die
Allowing for Flexibility in Application Use
? Less Component Placement for Board Space Savings
? SO-8 Surface Mount Package,
Mounting Information for SO-8 Package Provided
? Pb-Free Packages are Available
Applications
? DC-DC Converters
? Low Voltage Motor Control
? Power Management in Portable and Battery-Powered Products,
i.e.: Computers, Printers, PCMCIA Cards, Cellular and Cordless Telephones
http://onsemi.com
MOSFET
-3.05 AMPERES
-20 VOLTS
0.085 W @ V GS = -10 V
SCHOTTKY DIODE
1.0 AMPERE
20 VOLTS
470 mV @ I F = 1.0 A
1 8
A C
MOSFET MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted).
A
2
7
C
Rating
Drain-to-Source Voltage
Gate-to-Source Voltage - Continuous
Symbol
V DSS
V GS
Value
-20
" 20
Unit
V
V
S
G
3
4
6
5
D
D
Thermal Resistance -
Junction-to-Ambient (Note 1)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ T A = 25 ° C
Continuous Drain Current @ T A = 70 ° C
Pulsed Drain Current (Note 4)
Thermal Resistance -
Junction-to-Ambient (Note 2)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ T A = 25 ° C
Continuous Drain Current @ T A = 70 ° C
Pulsed Drain Current (Note 4)
Thermal Resistance -
Junction-to-Ambient (Note 3)
Total Power Dissipation @ T A = 25 ° C
Continuous Drain Current @ T A = 25 ° C
Continuous Drain Current @ T A = 70 ° C
Pulsed Drain Current (Note 4)
Operating and Storage Temperature Range
R q JA
P D
I D
I D
I DM
R q JA
P D
I D
I D
I DM
R q JA
P D
I D
I D
I DM
T J , T stg
171
0.73
-2.34
-1.87
-8.0
100
1.25
-3.05
-2.44
-12
62.5
2.0
-3.86
-3.10
-15
- 55 to
° C/W
W
A
A
A
° C/W
W
A
A
A
° C/W
W
A
A
A
° C
8
1
SO-8
CASE 751
STYLE 18
E3P1
xx
A
Y
WW
G
(TOP VIEW)
MARKING DIAGRAM &
PIN ASSIGNMENT
C C D D
8
E3P1xx
AYWW G
G
1
A A S G
= Device Code
= 02 or S
= Assembly Location
= Year
= Work Week
= Pb-Free Package
+150
(Note: Microdot may be in either location)
Single Pulse Drain-to-Source Avalanche
Energy - Starting T J = 25 ° C
(V DD = -20 Vdc, V GS = -4.5 Vdc,
Peak I L = -7.5 Apk, L = 5 mH, R G = 25 W )
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
E AS
T L
140
260
mJ
° C
ORDERING INFORMATION
Device Package Shipping ?
NTMSD3P102R2 SO-8 2500/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NTMSD3P102R2G
NTMSD3P102R2SG
SO-8
(Pb-Free)
SO-8
2500/Tape & Reel
2500/Tape & Reel
1. Minimum FR-4 or G-10 PCB, Steady State.
2. Mounted onto a 2 ″ square FR-4 Board (1 in sq, 2 oz Cu 0.06 ″ thick
single-sided), Steady State.
3. Mounted onto a 2 ″ square FR-4 Board (1 in sq, 2 oz Cu 0.06 ″ thick single
sided), t ≤ 10 seconds.
4. Pulse Test: Pulse Width = 300 m s, Duty Cycle = 2%.
(Pb-Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 3
1
Publication Order Number:
NTMSD3P102R2/D
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