参数资料
型号: NVD5862NT4G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 60V 90A DPAK-4
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 18A
开态Rds(最大)@ Id, Vgs @ 25° C: 5.7 毫欧 @ 48A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 82nC @ 10V
输入电容 (Ciss) @ Vds: 6000pF @ 25V
功率 - 最大: 4.1W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: DPAK-3
包装: 带卷 (TR)
NVD5862N
Power MOSFET
60 V, 5.7 m W , 98 A, Single N ? Channel
Features
? Low R DS(on) to Minimize Conduction Losses
? High Current Capability
? Avalanche Energy Specified
? AEC ? Q101 Qualified
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
V (BR)DSS
60 V
http://onsemi.com
R DS(on)
5.7 m W @ 10 V
I D
98 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
60
Unit
V
D
Gate ? to ? Source Voltage
Continuous Drain Cur-
rent R q JC (Note 1)
Power Dissipation R q JC
(Note 1)
Continuous Drain Cur-
rent R q JA (Notes 1 & 2)
Power Dissipation R q JA
(Notes 1 & 2)
Steady
State
Steady
State
T C = 25 ° C
T C = 100 ° C
T C = 25 ° C
T C = 100 ° C
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
T A = 100 ° C
V GS
I D
P D
I D
P D
" 20
98
69
115
58
18
13
4.1
2.0
V
A
W
A
W
G
1 2
3
S
4
N ? Channel
Pulsed Drain Current
Current Limited by
Package (Note 3)
T A = 25 ° C, t p = 10 m s
T A = 25 ° C
I DM
I Dmaxpkg
367
60
A
A
DPAK
CASE 369AA
STYLE 2
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy (T J = 25 ° C, V DD = 50 V, V GS = 10 V,
I L(pk) = 37 A, L = 0.3 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J , T stg
I S
E AS
T L
? 55 to
175
96
205
260
° C
A
mJ
° C
MARKING DIAGRAMS
& PIN ASSIGNMENT
4
Drain
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
2
1 Drain 3
Gate Source
Parameter
Symbol
Value
Unit
Y
= Year
Junction ? to ? Case ? Steady State (Drain) R q JC 1.3 ° C/W
Junction ? to ? Ambient ? Steady State (Note 2) R q JA 37
1. The entire application environment impacts the thermal resistance values
shown, they are not constants and are only valid for the particular conditions
noted.
2. Surface ? mounted on FR4 board using a 650 mm 2 , 2 oz. Cu pad.
3. Continuous DC current rating. Maximum current for pulses as long as 1
second are higher but are dependent on pulse duration and duty cycle.
WW = Work Week
V5862 = Device Code
G = Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2010
December, 2010 ? Rev. 0
1
Publication Order Number:
NVD5862N/D
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