- 您现在的位置：买卖IC网 > PDF目录12023 > P89V51RD2FN,112 (NXP Semiconductors)IC 80C51 MCU FLASH 64K 40-DIP PDF资料下载
参数资料
| 型号： | P89V51RD2FN,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 51/80页 |
| 文件大小： | 0K |
| 描述： | IC 80C51 MCU FLASH 64K 40-DIP |
| 产品培训模块： | Migrating from 8/16-Bit MCUs to 32-Bit ARMs |
| 标准包装： | 9 |
| 系列： | 89V |
| 核心处理器： | 8051 |
| 芯体尺寸： | 8-位 |
| 速度： | 40MHz |
| 连通性： | SPI，UART/USART |
| 外围设备： | 欠压检测/复位，POR，PWM，WDT |
| 输入/输出数： | 32 |
| 程序存储器容量： | 64KB（64K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 1K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 4.5 V ~ 5.5 V |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 40-DIP（0.600"，15.24mm） |
| 包装： | 管件 |
| 产品目录页面： | 706 (CN2011-ZH PDF) |
| 配用： | 622-1017-ND - BOARD 44-ZIF PLCC SOCKET 622-1001-ND - USB IN-CIRCUIT PROG 80C51ISP |
| 其它名称： | 568-2431-5 935277948112 P89V51RD2FN |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页当前第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页
2009-2011 Microchip Technology Inc.
DS39960D-page 55
PIC18F87K22 FAMILY
3.8
Effects of Power-Managed Modes
on the Various Clock Sources
When PRI_IDLE mode is selected, the designated pri-
mary oscillator continues to run without interruption.
For all other power-managed modes, the oscillator
using the OSC1 pin is disabled. The OSC1 pin (and
OSC2 pin if used by the oscillator) will stop oscillating.
In
secondary
clock
modes
(SEC_RUN
and
SEC_IDLE), the SOSC oscillator is operating and
providing the device clock. The SOSC oscillator may
also run in all power-managed modes if required to
clock SOSC.
In RC_RUN and RC_IDLE modes, the internal
oscillator provides the device clock source. The 31 kHz
LF-INTOSC output can be used directly to provide the
clock and may be enabled to support various special
features, regardless of the power-managed mode (see
through
for more
information on WDT, Fail-Safe Clock Monitor and
Two-Speed Start-up).
If Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
Enabling any on-chip feature that will operate during
Sleep will increase the current consumed during Sleep.
The INTOSC is required to support WDT operation.
The SOSC oscillator may be operating to support a
Real-Time Clock (RTC). Other features may be operat-
ing that do not require a device clock source (i.e.,
MSSP slave, INTx pins and others). Peripherals that
may add significant current consumption are listed in
.
3.9
Power-up Delays
Power-up delays are controlled by two timers, so that
no external Reset circuitry is required for most applica-
tions. The delays ensure that the device is kept in
Reset until the device power supply is stable under nor-
mal circumstances and the primary clock is operating
and stable. For additional information on power-up
delays, see Section 5.6 “Power-up Timer (PWRT)”.
The first timer is the Power-up Timer (PWRT), which
provides a fixed delay on a power-up time of about
64 ms (Parameter 33, Table 31-13); it is always
enabled.
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the
crystal oscillator is stable (HS, XT or LP modes). The
OST does this by counting 1,024 oscillator cycles
before allowing the oscillator to clock the device.
Table 31-13), following POR, while the controller
becomes ready to execute instructions.
TABLE 3-4:
OSC1 AND OSC2 PIN STATES IN SLEEP MODE
Oscillator Mode
OSC1 Pin
OSC2 Pin
EC, ECPLL
Floating, pulled by external clock
At logic low (clock/4 output)
HS, HSPLL
Feedback inverter is disabled at quiescent
voltage level
Feedback inverter is disabled at quiescent
voltage level
INTOSC, INTPLL1/2
I/O pin, RA6, direction is controlled by
TRISA<6>
I/O pin, RA6, direction is controlled by
TRISA<7>
Note:
See Section 5.0 “Reset” for time-outs due to Sleep and MCLR Reset.
相关PDF资料 |
PDF描述 |
|---|---|
| P89V51RC2FN,112 | IC 80C51 MCU FLASH 32K 40-DIP |
| P89V51RC2FBC,557 | IC 80C51 MCU FLASH 32K 44-TQFP |
| 292303-1 | CONN USB RECEPT R/A TYPE A 4POS |
| VI-B3V-CU-B1 | CONVERTER MOD DC/DC 5.8V 200W |
| VJ1825A562KBCAT4X | CAP CER 5600PF 200V 10% NP0 1825 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| P89V52X2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:8-bit 80C51 low power 8 kB flash microcontroller with 256 B RAM, 192 B data EEPROM |
| P89V52X2FA | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:8-bit 80C51 low power 8 kB flash microcontroller with 256 B RAM, 192 B data EEPROM |
| P89V52X2FA,512 | 功能描述:8位微控制器 -MCU 80C51 8K FL / 256 RM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| P89V52X2FBD | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:8-bit 80C51 low power 8 kB flash microcontroller with 256 B RAM, 192 B data EEPROM |
| P89V52X2FBD,157 | 功能描述:8位微控制器 -MCU 80C51 8K FL / 256 RM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
发布紧急采购，3分钟左右您将得到回复。