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参数资料
| 型号： | PCA8802CX8/B/1 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PBGA8 |
| 封装： | 1.19 X 1.14 MM, 0.29 MM HEIGHT, LEAD FREE, WLCSP-8 |
| 文件页数： | 16/34页 |
| 文件大小： | 160K |
| 代理商： | PCA8802CX8/B/1 |
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PCA8802_1
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 19 February 2009
23 of 34
NXP Semiconductors
PCA8802
Smartcard RTC
13. Bare die information
13.1 Locations
[1]
All coordinates are referenced, in
[2]
The substrate (rear side of the die) is wired to VSS but should not be electrically connected.
[3]
Die size before dicing. Final dimensions will be 10
m to 20 m smaller.
13.2 PCB or foil landing site
The layout of the landing sites is important. It is recommended to follow the following
guidelines
1. All landing sites should be the same size. When one site has a different size or shape,
e.g. to indicate pad one, then the pull on the die produced by the surface tension of
the solder will be different in one place. This variation can lead to the die not laying at
on the Printed-Circuit Board (PCB) or foil. This can also result in weak solder joints for
some pins.
2. It is recommended to use circular landing sites of the same diameter as the solder
ball. This will help with self alignment. Solder bump dimensions may be found in
Table 13.
Bump and reference point locations
Symbol
Pad
Coordinates[1]
x
y
INT
1
437
396
VDD
2
12
430
TEST
3
460
396
OSCO
4
460
1
OSCI
5
460
396
VSS[2]
6
12
430
SCL
7
437
396
SDA
8
437
1
pin 1 identier
-
474.7
472.0
bottom left die corner[3] -
594.8
568.2
top right die corner[3]
-
594.7
568.3
Pin 1 is identied by this symbol.
Fig 28. Pin 1 identier
001aaj154
REF
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