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| 型号： | PCA8802CX8/B/1 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PBGA8 |
| 封装： | 1.19 X 1.14 MM, 0.29 MM HEIGHT, LEAD FREE, WLCSP-8 |
| 文件页数： | 27/34页 |
| 文件大小： | 160K |
| 代理商： | PCA8802CX8/B/1 |
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PCA8802_1
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 19 February 2009
33 of 34
NXP Semiconductors
PCA8802
Smartcard RTC
19. Legal information
19.1
Data sheet status
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Denitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2
Denitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
ofce. In case of any inconsistency or conict with the short data sheet, the
full data sheet shall prevail.
19.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specied use without further testing or modication.
Limiting values — Stress above one or more limiting values (as dened in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/prole/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Bare die — All die are tested on compliance with their related technical
specications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
19.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales ofce addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2]
Product status[3]
Denition
Objective [short] data sheet
Development
This document contains data from the objective specication for product development.
Preliminary [short] data sheet
Qualication
This document contains data from the preliminary specication.
Product [short] data sheet
Production
This document contains the product specication.
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| PCA8802UG/12KB/1,0 | 制造商:NXP Semiconductors 功能描述:PCA8802UG/UNCASED/FOIL//12KB/1 - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:NXP Semiconductors 功能描述:IC SMARTCARD RTC ULP OSC 8WLCSP |
| PCA887A/CW/DP1S | 制造商:Rochester Electronics LLC 功能描述: 制造商:Zarlink Semiconductor Inc 功能描述: 制造商:ZARLINK 功能描述: |
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