参数资料
| 型号： | PCA9500PW,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 21/26页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16TSSOP |
| 产品培训模块： | I²C Bus Fundamentals |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 96 |
| 接口： | I²C，SM 总线 |
| 输入/输出数： | 8 |
| 中断输出： | 无 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.5 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 管件 |
| 包括： | EEPROM，POR |
| 产品目录页面： | 824 (CN2011-ZH PDF) |
| 其它名称： | 568-1025-5 935271534112 PCA9500PW |
PCA9500_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 15 April 2009
4 of 26
NXP Semiconductors
PCA9500
8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM
6.2 Pin description
[1]
HVQFN16 package supply ground is connected to both VSS pin and exposed center pad. VSS pin must be
connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level
performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the
board and for proper heat conduction through the board, thermal vias need to be incorporated in the
printed-circuit board in the thermal pad region.
Fig 4.
Pin conguration for HVQFN16
SCL
WC
IO7
IO6
002aae584
PCA9500BS
Transparent top view
IO3
V
SS
IO4
IO5
A1
A2
V
DD
SDA
4
9
3
10
2
11
1
12
5
6
7
8
16
15
14
13
terminal 1
index area
A2
IO0
IO1
IO2
Table 3.
Pin description
Symbol
Pin
Description
SO16, TSSOP16
HVQFN16
A0
1
15
address lines (internal pull-up)
A1
2
16
A2
3
1
IO0
4
2
quasi-bidirectional I/O pins
IO1
5
3
IO2
6
4
IO3
7
5
IO4
9
7
IO5
10
8
IO6
11
9
IO7
12
10
VSS
86[1]
supply ground
WC
13
11
active LOW write control pin
SCL
14
12
I2C-bus serial clock
SDA
15
13
I2C-bus serial data
VDD
16
14
supply voltage
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